The leadless SMD package for CoolMOS™ superjunction MOSFET
Infineon's ThinPAK 8x8, a leadless SMD package for high voltage MOSFETs, has a very small footprint of only 64mm² (vs. 150mm² for the D²PAK) and a very low profile with only 1mm height (vs. 4.4mm for the D²PAK). This significantly smaller package size in combination with its benchmark low parasitic inductances is highly effective to decrease system solution size in power-density driven designs.
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