Infineon's TO-Leadless package is optimized for high current applications such as forklift, light electric vehicles (LEV), POL (point-of-load) and telecom. This package is a perfect solution for high power applications where highest efficiency, outstanding EMI behaviour as well as best thermal behaviour and space reduction are required.
Summary of Features:
- Industry‘s lowest R DS(on)
- Highest current capability up to 300A
- Very low package parasitics and inductances
- Less paralleling and cooling required
- Highest system reliability
- System cost reduction
- Enabling very compact design
- Light electric vehicles (LEV) e.g. e-scooter, e-bikes or µ-car
- Point-of-load (POL)
Find an answer to your question
Technical Assistance Center (TAC)
Infineon welcomes your comments and questions.
If you have any questions concerning our products, please fill out the following form. Your inquiry will be sent to the appropriate specialist who will be in touch with you as soon as possible.
You will receive a confirmation E-mail to validate your address in our system. Any attached file to the reply which will help to support your inquiry is highly appreciated.