Smart

Overview

SmartPIM and SmartPACK - Self-acting PressFIT assembly

Power electronics users are increasingly demanding easy-to-use connections and mounting technologies. The well-known PressFIT technology offers the possibility of solderless mounting combined with improved reliability in comparison to soldering.

We developed a module family that meet evolving assembly and reliability demands. The sophisticated and reliable mounting concept combines the existing PressFIT contact with a very basic inverter mounting and assembly technology.

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Details

The housing allows the module to be connected to the heat sink and the PCB in a single-step mounting process. In the Smart1, this easy mounting concept is realized by using only one screw. During this mounting process, the PressFIT pin is pressed into the PCB, the PCB is stabilized and the module is mounted in the same step on the surface of the heat sink. The whole mounting concept needs no additional tools; only an electrical screw driver is used. All well-known electrical circuits are feasible. The housing supports currents of up to 75 A.

This module family provides all reliability characteristics known from the established PressFIT technology and comes up with advanced features and benefits:

Features Applications
  • Press in process by tightening the module 
  • Flexible mounting possibilities;
  • The new module and mounting concept reduces process time;
  • Robust housing concept with decoupled DCB force;
  • Gas tight contact so no climate sequence has a negative effect;
  • Decreased FIT-rates for interconnections;
  • Reliable cold welded connection of module pins and PCB;
  • Mounting possible on both sides of standard PCBs 

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PressFIT Technology

Customers of power electronics require ever more modern, easy connection technologies, which also provide a higher reliability to meet the trends to higher temperatures and new applications.

PressFIT is a force fitting technology for power semiconductor modules, which offers these possibilities.

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