Summary of Features:
- High power density
- Established Easy module concept
- Integrated temperature sensor available
- Low stray inductance module design
- RoHS-compliant modules
- Compact module concept
- Optimized customer’s development cycle time and cost
- Configuration flexibility
This Module can be driven by the dedicated Evaluation Board.
Also available as variation with Soldering connection technology: FP50R06W2E3
Simplify your design with one of our EiceDRIVER™ Compact HV Gate Driver ICs.
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