Summary of Features:
- High power density
- Established Easy module concept
- Integrated temperature sensor available
- Low stray inductance module design
- RoHS-compliant modules
- Compact module concept
- Optimized customer’s development cycle time and cost
- Configuration flexibility
This Module can be driven by the dedicated Evaluation Board.
Also available as variation with Soldering connection technology: FP25R12W2T4P
Optimize your application with an EiceDRIVER™ Enhanced HV Gate Driver IC.