Summary of Features:
- Low Switching Losses
- Trench IGBT 4
- T(vj oi) = 150°C
- Low V(cesat)
- AI(2)O(3) Substrate for Low Thermal Resistance
- Rugged Duplex frame construction
- Self-acting PressFIT Assembly
- Safe and simple mounting process
- Reduced assembly time
- Reliable connection of module Pins and PCB
- Flexible mounting possibilities
This Module can be driven by the dedicated Evaluation Board.
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