FS75R17W2E4P_B11 1700 V, 75 A sixpack IGBT module

Overview

EasyPACK™ 2 1700 V, 75 A sixpack IGBT module with TRENCHSTOP™ IGBT4, Emitter Controlled diode, NTC, PressFIT Contact Technology and pre-applied Thermal Interface Material.

Summary of Features

  • Low switching losses
  • Low VCEsat
  • Pressfit Pin
  • Pre-applied thermal interface material
  • Compact design

Benefits

  • 12mm height Easy package with Al2O3 substrate with low thermal resistance
  • High automation level and production efficiency
  • No handling of thermal grease in the production line
  • Lowers process costs in manufacturing
Product image for easy 2B IGBT modules
Diagrams
Diagram for FS75R17W2E4P_B11
Videos

PressFIT Technology

Customers of power electronics require ever more modern, easy connection technologies, which also provide a higher reliability to meet the trends to higher temperatures and new applications.

Support