Automotive IGBT Modules

With our HybridPACK™ and EasyPACK™ products Infineon offers a broad portfolio of half bridge and six-pack power semiconductor modules which have been specially designed and qualified for hybrid and electric vehicle applications. Variations in the requirements for full hybrid applications have been taken into account for each design. Thanks to the selection of five different packages addressing different power classes, versatility of design integration is provided. Enhanced versions of these power modules support a maximum junction temperature of 175°C for power peaks.

HybridPACK™ Drive is a very compact power module optimized for hybrid and electric vehicle main inverter applications for a power range from 100 to 175 kW. The power module implements the new EDT2 IGBT chip generation, which is an automotive Micro-Pattern Trench-Field-Stop cell design. The chipset has benchmark current density combined with short circuit ruggedness and increased blocking voltage for reliable inverter operation under harsh environmental conditions. HybridPACK™ Drive modules offer scalability via thermal stacks to support customers’ platform approach. The HybridPACK™ Drive is an easy-to-mount SixPack module for direct water cooling with three different baseplates and supports an optimized assembly process

Our emphasis on innovation is not only recognizable in the variety of frame based power modules, but also in the HybridPACK™ DSC. Thanks to its double side cooling Technology and IGBT half bridge configuration, this power module is the ideal solution for compact and flexible main inverter designs up to 75 kW. Two copper plates on both sides of the module are used for double-sided cooling (DSC) and herewith enable high power density. On chip temperature and current sensors (overcurrent protection) offer a good compromise between security and performance. HybridPACK™ DSC modules offer scalability via stacking to support customers’ platform approach.

Infineons HybridPACK™ 1 is a proven and established automotive qualified power module for xEV applications covering low power classes from approximately 15 to 70 kW. Designed for a 150°C junction operation temperature, the module accommodates a 3-phase Six-Pack configuration of Trench-Field-Stop IGBT3 and matching emitter controlled diodes. The HybridPACK™ 1 power module is based on Infineon’s IGBT Trench-FieldStop Technology and is suitable for air or liquid cooling. For a compact design the driver stage PCB can easily be soldered on top of the module. All power connections are realized with screw terminals. 

This design gained acceptance on the market and lead to pave the way for further frame modules. Infineon followed up by introducing the HybridPACK™ DC6. Two baseplate variants (flat and wave) enable direct water cooling. Therefore better thermal performance can be achieved while different baseplates within the same footprint keep the performance scalable. Six instead of two power tabs on the DC side lower the stray inductivity and allow to extract more current from the power module. By that, the module is able to achieve higher power ranges from approximately 60 to 90 kW.

Key target applications for the HybridPACK™ 1 & DC6 family are inverters for hybrid and small battery electric cars and generators.

For our automotive EasyPACK™ we took our long proven industrial Easy modules and integrated different chip contents and topologies for automotive auxiliary, OBC and DC-DC applications. To ensure highest quality standards and safety, the package technology has then been improved and qualified to meet automotive requirements.

EasyPACKs enables a high integration density and a fast and easy assembly process. With its two footprints Easy 1B and Easy 2B it provides a platform for different power classes. As the EasyPACK™ is a very flexible package, customization to fit the customer’s needs is possible by adding further chip technologies in different topologies.

Our evaluation kits are designed to support customers in their first steps in designing applications with our power modules. All of our evaluation kits are open designs. Therefore, they can be taken as a design reference for applications utilizing HybridPACK™ or EasyPACK™ modules. In addition they can help to test the electrical and thermal performance of our power modules in an example application.

Our main inverter evalution boards enable you to operate basic open loop inverters within a few minutes and without any software or communication to external control units.

This is a special mode well suited for passive three phase inductive loads and simple load tests (DEMO-MODE) up to the power modules maximum performance. The shipping content includes a CD with schematics, layout and bill of material, information on the gate driver board, logic board and interface PCB. For instance, the HybridKIT Drive is intended to demonstrate the outstanding performance of the latest Infineon IGBT generation EDT2 combined with our latest module package HybridPACK™ Drive. One of many approaches of designing inverters with our flexible molded modules can be found in the HybridKIT DSC. It implements our HybridPACK™ DSC S1 and demonstrates the modules double-sided cooling concept resulting in high power density as well as other features.

Another supported application which can be demonstrated with our EasyKIT is the HV/LV DC/DC Converter. The evaluation board – and our highly efficient EasyPACK™ itself – help to achieve less charging losses, increased battery voltage and charging speed.