Automotive IGBT Modules

Overview

Automotive IGBT modules based on leading IGBT technology designed for Hybrid electric and full Electric Vehicle (xEV) applications.

Infineon offers a wide range of automotive qualified IGBT Modules. Infineon´s HybridPACK™ and EasyPACK™ families extend across the full power spectrum required by IGBT modules in hybrid and electric vehicles. Various product versions in five different packages enable maximum scalability across voltage and power classes, from 50 A to 950 A and 400 V to 1200 V (nominal chip values).

Thanks to leading IGBT technologies our range of automotive qualified high-power modules all have one thing in common: They offer the highest power densities and efficiency. With several HybridPACK™ and EasyPACK™ product families to choose from, we can offer the best technical fit for a range of applications including main inverter, on-board battery charger, auxiliary inverters and HV/LV DC-DC converter.

Products
Highlights
Videos

Infineon leads xEV automotive power module innovation with new HybridPACK™ product portfolio for main inverters

1:36

This video showcasts Infineon´s new HybridPACK™, a scalable family of automotive power modules products with different cooling options suitable for main inverters up to 200 kW More information: https://www.infineon.com/automotivepowermodules

Scalability up to the highest power for electric vehicles (xEV) in main inverter

2:09

Infineon introduces its large portfolio of IGBT automotive components. Starting from discretes solutions such the main inverter demo implemented by SUNGROW, HybridPACK™ drive power modules, HybridPACK™ 1 DC6 wave, HybridPACK™ drive CoolSiC™, low-loss DuoPack: IGBT in TRENCHSTOP™; and evaluation board for EiceDRIVER™ sense and EiceDRIVER™ Boost More information: https://www.infineon.com/automotivepowermodules https://www.infineon.com/sic-automotive

Training

HybridPACK™ Double-Sided Cooling S2 for compact and efficient inverter design

Infineon introduces an update to the HybridPACK™ DSC, a product family of double-sided cooled power modules for main inverters in hybrid and full electric vehicles. In this training, you will learn more about the newest addition to the HybridPACK™ DSC family: HybridPACK™ DSC S2 with EDT2 chip technology.

HybridPACK™ Drive – Scalability and Ease of Design

 HybridPACK™ Drive addresses the 3 main challenges that main inverter solutions currently face:

  • Performance increase
  • Scalable performance
  • And ease-of-design, aimed at reducing customer’s time to market and system cost.

Infineon’s automotive power semiconductor module portfolio

  • Understand how Infineon’s power semiconductor module portfolio is a solution for the main challenges of the electric vehicle industry
  • Know Infineon’s general value drivers as well as recent success stories on the electromobility market

 

Support