Automotive IGBT Modules
Automotive IGBT Modules subcategories
Automotive IGBT modules based on leading IGBT technology designed for Hybrid electric and full Electric Vehicle (xEV) applications.
Infineon offers a wide range of automotive qualified IGBT Modules. Infineon´s HybridPACK™ and EasyPACK™ families extend across the full power spectrum required by IGBT modules in hybrid and electric vehicles. Various product versions in five different packages enable maximum scalability across voltage and power classes, from 50 A to 950 A and 400 V to 1200 V (nominal chip values), using our leading Automotive Silicon and CoolSiC TM Technologies.
Thanks to leading IGBT technologies our range of automotive qualified high-power modules all have one thing in common: They offer the highest power densities and efficiency. With several HybridPACK™ and EasyPACK™ product families to choose from, we can offer the best technical fit for a range of applications including traction inverter, on-board battery charger, auxiliary inverters and HV/LV DC-DC converter.
With our HybridPACK™ and EasyPACK™ products, Infineon offers a broad portfolio of half bridge and six-pack power semiconductor modules which have been specially designed and qualified for hybrid and electric vehicle applications. Thanks to the selection of five different packages addressing different power classes, versatility of design integration is provided and the best fitting product for each requirement can be offered.
- Our evaluation kits are designed to support customers in their first steps in designing applications with our power modules. All of our evaluation kits are open designs. Therefore, they can be taken as a design reference for applications utilizing HybridPACK™ or EasyPACK™ modules. In addition they can help to test the electrical and thermal performance of our power modules in an example application.
- Our main inverter evalution boards enable you to operate basic open loop inverters within a few minutes and without any software or communication to external control units.
- Passive three phase inductive loads and simple load tests (DEMO-MODE) can be driven up to the maximum performance of the power modules. The shipping content includes a data source with schematics, layout and bill of material, information on the gate driver board, logic board and interface PCB. For instance, the HybridKIT Drive is intended to demonstrate the outstanding performance of the latest Infineon IGBT generation EDT2 combined with our latest module package HybridPACK™ Drive. One of many approaches of designing inverters with our flexible molded modules can be found in the HybridKIT DSC. It implements our HybridPACK™ DSC S1 or S2 and demonstrates the modules double-sided cooling concept resulting in high power density and advanced sensing & diagnostic concepts.
- Another supported application which can be demonstrated with our EasyKIT is the HV/LV DC/DC Converter. The evaluation board – and our highly efficient EasyPACK™ itself – help to achieve less charging losses, increased battery voltage and charging speed.