Automotive IGBT Modules
Power semiconductor modules to match OEM and tier-1 needs in xEV platform strategy.
Infineon’s HybridPACK™ family extends across the full power spectrum required by IGBT modules in hybrid and electric vehicles. Various product versions in six different packages enable maximum scalability across voltage and power classes, from 200 A to 900 A and 400 V to 1200 V (nominal chip values).
HybridPACKTM DSC is Infineon’s new innovative solution for the main inverter of hybrid and electric vehicles. It offers increased power density due to double-sided cooling of the molded module. The die temperature and current sensors can help to drive the IGBT closer to their limit to further improve the power density. HybridPACK DSC modules offer scalability via stacking to support customers’ platform approach.
HybridPACK™ Drive is a very compact power module optimized for hybrid and electric vehicle main inverter applications (xEV) for a power range up to 150 kW. The power module implements the new EDT2 IGBT chip generation, which is an automotive Micro-Pattern Trench-Field-Stop cell design. The chipset has benchmark current density combined with short circuit ruggedness and increased blocking voltage for reliable inverter operation under harsh environmental conditions.
Infineon’s HybridPACK™ family extends across the full power spectrum required by IGBT modules in hybrid and electric vehicles. The various product versions are achieved through package innovations and chip development within the product portfolio.