| MIL-PRF-38535 covers screening requirements that all parts are submitted to as well as Quality Conformance Inspection consisting of one or more of Group A, B, C and D for acceptance of the design of the process and of the production lot. MIL-PRF-38535 applies to microelectronic circuits such as integrated circuits. For more information on MIL-PRF-38535 screening and quality conformance inspection, consult the DoD document or contact IR HiRel. |
| |
MIL-PRF-38535 Screening Requirements
for class level S and level B |
| Test/Inspection |
Screening Level |
MIL-STD-883
Method |
| Level B |
Level S |
| Non-destructive bond pull |
- |
* |
2023 |
| Internal visual inspection |
100% |
100% |
2010, condition B for class level B
2010, condition A for class level S |
| Temperature cycling |
100% |
100% |
1010, condition C |
| Constant acceleration |
100% |
100% |
2001, condition E |
| External visual inspection |
100% |
100% |
|
Particle impact noise detection
(PIND) |
- |
100% |
2020, condition A for class level S |
| Serialization |
1 |
100% |
|
| Preburn-in electrical parameters |
100% |
100% |
|
| Burn-in |
100%
160 hours |
100%
240 hours |
1015 |
| Interim electrical parameters |
- |
100% |
|
| High temperature reverse bias (HTRB) |
- |
100%
72 hours |
1015, condition A or C |
| Interim electrical parameters |
100% |
100% |
|
Percent defective allowable
(PDA) calculation |
5% |
5% |
|
Final electrical test
Static @ 25°C
Static @ min and max temps
Switching test @ 25°C |
100%
100%
100% |
100%
100%
100% |
|
| Hermetic seal (fine and gross leak) |
100% |
100% |
1014 |
| Radiography |
- |
100% |
2012 |
| External visual inspection |
100% |
100% |
2009 |
|
| * Process Monitor |
| |
| MIL-PRF-38535 Quality Conformance Inspection Requirements MIL-PRF-38535 Group A Electrical Testing |
Sub
Group |
Parameters |
Quantity
(accept number) |
| 1 |
Static tests at +25°C |
116 (0) |
| 2 |
Static tests at max. rated operating temp. |
116 (0) |
| 3 |
Static tests at min. rated operating temp. |
116 (0) |
| 4 |
Dynamic tests at +25°C |
116 (0) |
| 5 |
Dynamic tests at max. rated operating temp. |
116 (0) |
| 6 |
Dynamic tests at min. rated operating temp. |
116 (0) |
| 7 |
Functional tests at +25°C |
116 (0) |
| 8 |
Functional tests at max. & min. rated operating temp. |
116 (0) |
| 9 |
Switching tests at +25°C |
116 (0) |
| 10 |
Switching tests at max. rated operating temp. |
116 (0) |
| 11 |
Switching tests at min. rated operating temp. |
116 (0) |
|
| |
| MIL-PRF-38535 Group B Testing |
Sub
Group |
Parameters |
Minimum Sample Size
Quantity (accept number) |
| 1 |
Resistance to solvents |
3 (0) |
| 2 |
Bond strength:
a. Thermocompression
b. Ultrasonic
c. Flip-chip
d. Beam lead |
22 (0)
Based on the number of wires |
| Die shear test or stud pull |
3 (0) |
| 3 |
Solderability |
per MIL-PRF-38535 |
|
| |
| MIL-PRF-38535 Group C Testing |
Sub
Group |
Parameters |
Quantity
(accept number) |
| 1 |
Steady-state life test
End-point electrical parameters |
45 (0) |
|
| |
| MIL-PRF-38535 Group D Testing |
Sub
Group |
Parameters |
Quantity
(accept number) |
| 1 |
Physical dimensions |
15 (0) |
| 2 |
Lead Integrity
Seal (fine and gross) |
15 (0) |
| 3 |
Thermal Shock
Temperature Cycling
Moisture resistance
Seal (fine and gross)
Visual
End-point electricals |
15 (0) |
| 4 |
Shock
Vibration, variable frequency
Acceleration
Seal (fine and gross)
Visual |
15 (0) |
| 5 |
Salt atmosphere
Seal (fine and gross)
Visual |
15 (0) |
| 6 |
Internal water vapor (cavity packages) |
3 (0) or 5 (1) |
| 7 |
Adhesion of lead finish |
15 (0) |
| 8 |
Lid torque |
5 (0) |
|
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