EV INV HP1 SI 07 Enhance Automotive and eMobility Applications with Infineon's Evaluation Kit for HybridPACK™ 1 Main Inverter, Gate Driver, and Logic Board

Overview

Infineon's Evaluation Kit features the HybridPACK™ 1 power module, coreless transformer isolated driver (1ED020I12- FA), and logic board, making it ideal for (H)EV applications up to 20kW. With automotive qualified IGBT and Diode chip set, driver IC, and coreless transformer technology, it offers up to 1200 V and 2 A driving capability, Vce sat-detection, and compatibility with various motor position interfaces like encoder, resolver, and GMR for automotive applications, all powered by the TriCore™ family 32-bit microcontroller TC1767.

Summary of Features

  • Main inverter for (H)EVs up to 20 kW
  • Automotive IGBT module HybridPACK™1
  • 650 V/400 A IGBT & Diode chip set
  • Automotive Driver IC 1ED020I12-FA
  • Coreless transformer technology
  • Up to 1200V and 2A capability
  • Vce sat - detection
  • TriCore™ 32-bit microcontroller TC1767
  • Various motor position interfaces

Potential Applications

Hybrid Electrical Vehicles Commercial and Agriculture Vehicles Air Conditioning System Drives        

 

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