DEMO_HV_PACKAGE Advantages of Infineon's high-voltage power packages
Overview
Discover the benefits of Infineon's high-voltage power packages, featuring CoolSiC™ and CoolMOS™ technology. The Demo_HV_package board helps designers understand how to integrate our bottom- and top-side cooled packages effectively into their designs. Benefit from simplified assembly and reduced design complexity to achieve optimal thermal performance for highest efficiency and power density at lower system cost.
Summary of Features
- Improved power loop design
- Innovative cooling concepts: BSC & TSC
- Optimized design of the half bridge
- Lower stray inductance
- Kelvin source pin
- 3D concept: cooling & power loop integr.
Benefits
- Faster & cheaper in production assembly
- Higher switching capabilities
- Better control & reduced power losses
- Possibility of double side PCB assembly
List of Components:
Potential Applications
Support
