Tempo and Infineon enable multi-microphone solutions with exceptional performance
Our partner Tempo Semiconductor delivers ultra-low power, high-fidelity mixed signal audio semiconductor solutions to the consumer, PC, and industrial markets. Tempo and Infineon are collaborating to create and commercialize joint solutions for customer projects in the field of voice-user interfaces and other audio applications.
Tempo’s TSDP1808x digital mic aggregator (DMIC) and Infineon’s XENSIV™ MEMS microphone deliver the highest performance multi-mic solution in the industry. TSDP18xx delivers large BOM cost savings over current multiple mic solutions, reduced smart speaker power consumption, and offloads the primary SOC, enabling additional, higher complexity signal processing and features. Infineon XENSIV™ MEMS microphones deliver exceptional accuracy and best-in class measurement performance.
Tempo and Infineon’s microphone array solution, the Audio Hub Nano, uses two IM69D130 XENSIV™ MEMS microphones and Tempo’s TSDP1808xx >142 dB hardware decimator. The solution enables true 24-bit audio support for smart speakers and video conferencing solutions. Tempo’s TSDP1808x hardware decimator enables audio DSPs to offload this function and instead use the DSP resources for more value-add audio algorithms and features. With the Audio Hub Nano A, developers are provided with a solution for easy plug and play audio recordings and quick evaluation of best in class XENSIV™ MEMS microphones.
To purchase or learn more about the Audio Hub Nano, we invite you to explore our evaluation board website.