At a glance

The student, as part of the Engineering: Research & Development team and under the guidance of an assigned mentor, will undertake projects working on Infineon’s flagship 3D Printing and Assembly

Quick info

Location Singapore
Entry level Internship
Job ID 37922
Start Oct 01, 2019
Type Full time
Contract Temporary

Job description

In your new role you will:
• Assist to identify critical 3D printing materials for relevant projects
• Be involved in building prototype for IC packaging application assessment that involves assy tooling, jigs and fixtures
• Manage project feasibility of using 3D printing for IC Packaging Assembly
• Support key functions on constructing suitable applications for 3D printing

Learning outcomes:
• Identify potential application of 3D printing IC package development
• Gain exposure into high volume manufacturing with the critical technology identified
• Establish internal know-how of 3D printing methods
• Enhance knowledge through comparison of advantage and disadvantage of 3D printing versus existing methods


You are best equipped for this task if you have:
• On track to attain a diploma in Mechatronics Engineering related study
• Know-how in industrial equipment that involves wirecut, EDM
• Proficient in using AutoCAD
• This is a minimum 4 to 6 months internship opportunity

About Us

Part of your life. Part of tomorrow.

We make life easier, safer and greener – with technology that achieves more, consumes less and is accessible to everyone. Microelectronics from Infineon is the key to a better future. Efficient use of energy, environmentally-friendly mobility and security in a connected world – we solve some of the most critical challenges that our society faces while taking a conscientious approach to the use of natural resources.

What we offer you in Singapore

Singapore is our regional headquarter for Asia-Pacific and consists of production, research & development, sales & marketing, supply chain and many central functions.

Find out more about our location Singapore