Infineon Technologies - Semiconductor and System Solutions
  • Products
  • Applications
  • Design Support
  • Community
  • About Infineon
  • Careers
  • Newsletter
  • Contact
  • Where to Buy
  • English
    • 简体中文
    • Deutsch
    • 日本語
  • myInfineon
    • Register for myInfineon
  • Cart
  • Company
  • Our Divisions
  • Management Board
  • Supervisory Board
  • Our Locations
  • Procurement
  • Quality
  • Infineon Awards
  • Cybersecurity
  • Sustainability
  • Environmental Sustainability and Climate Protection
  • Safety and Health
  • Business Ethics
  • Corporate Citizenship
  • CSR Supply Chain Management
  • Human Rights
  • CSR Reporting
  • Press
  • General Information
  • Press Releases
  • Market News
  • Press Kits
  • Media Pool
  • Events
  • Contacts
  • Investor
  • Infineon at a Glance
  • News & Events
  • Reports & Presentations
  • Infineon Share
  • Fixed Income
  • Corporate Governance
  • Shareholder Service
  • Contact
  • Tradeshows & Conferences
  • Discoveries
  • New Mobility
  • Internet of Things
  • Energy Efficiency
  • All Discoveries
Videos
  • Careers
  • Job Search
  • Working at Infineon
  • Our Locations
  • Opportunities and Benefits
  • Students & Pupils
  • How to apply
Apply now
  • Home
  • Careers
  • Job Search
  • Job Search
  • Internship – Digitalization for Package Cost Estimation In Package Development Process
Apply now
Print E-Mail Share Bookmark

Your bookmarked jobs (0)

Add/remove jobs to your bookmark list to keep them in mind.

No jobs in your bookmark list yet.

    Other Jobs

    Job Search

    Master Thesis: Implementation of a wafer-level soft switching setup for GaN power transistors

    Villach (Austria)

    Job description

    Industriepraktikum: Roadmapping Support

    Villach (Austria)

    Job description

    Master Thesis: Electrical characterization of test structures of next generation SiC MOSFETs

    Villach (Austria)

    Job description

    Internship: Wafer Test Probing - Contacting Engineer

    Villach (Austria)

    Job description

    Senior Engineer Device Characterization and Modeling (f/m/div)*

    Munich (Germany)

    Job description

    Werkstudent: Package Entwicklung (w/m/div)*

    Regensburg (Germany)

    Job description

    Staff Technician Technology Development Characterization (w/m/div)*

    Villach (Austria)

    Job description

    Werkstudent: Technologieentwicklung (w/m/div)*

    Regensburg (Germany)

    Job description

    No matching position for you?

    Apply unsolicitedly
    Home > Careers > Job Search > Job Search > Internship – Digitalization for Package Cost Estimation In Package Development Process
    Follow us

    © 1999 - 2022 Infineon Technologies AG

    • Usage of this website is subject to our Usage Terms
    • Imprint
    • Contact
    • Privacy Policy
    • Glossary

    苏ICP备15016286号-1 | 苏公网安备 32021402001016号 | 营业执照

    • Switch to Mobile Version
    • Switch to Desktop Version