innovation & quality made by Infineon
As an employee of Infineon, you can experience and accompany the production of semiconductors from wafers to completely wired circuits. Infineon uses chip as well as packaging technology with production and development. Both of these are closely related, because it takes intelligent packages to turn microchips into finished high-tech components. In semiconductor manufacturing, our products move through many departments before they are finished. The chips run through the frontend-of-line (FE) and backend-of-line (BE) during the production.
In the so-called frontend-of-line, the production starts with a blank silicon disk and ends with the completely configured transistor, which is then used in microprocessors and memory chips.
All of the process steps which the wafer completes in its entirety are referred to as the frontend process. In the course of the production process, we treat the silicon disk with a broad spectrum of chemical and physical procedures.
Wafers are processed in a clean room. Even the smallest dust particles can destroy the fine chip structures in the 0.35 nm range. That is why for us, production in a clean room means absolute air purity through elaborate climate technology with about 400 air circulations per hour.
As an engineer for clean room technology, you are part of the core team for the work development (5S method) in the frontend modules; you are the contact person for clean room and grey room materials and define processes resulting in continuous improvement.
The significant processing steps include lighting, ion implantation and the application of metallization layers. Some of the stations are run through several times. In the end, up to 500 individual process steps may be involved.
In microchip production, several thousand different products are produced and developed on 200- and 300-mm silicon disks, such as power semiconductors as well as pressure and magnetic sensors, MEMS such as silicon microphones with the finest swinging membranes consisting of few atomic layers or high-frequency semiconductors for GPS modules and assistance systems.
The frontend cluster offers a wide range of manufacturing skills and specializes in the development of high-quality logic products. The portfolio consists of the areas of power, bipolar, sensor, passive and diode technology as well as CMOS, RF-CMOS and embedded Flash technologies. The production sites in Dresden, Kulim, Regensburg and Villach have committed to operational excellence with a strong customer orientation.
Once the processing of the wafers has been completed, they are forwarded to the backend-of-line. The backend production is part of the semiconductor manufacturing process, which is initiated once the wafer has left the clean room. This process includes checking the chips on the wafer, potentially necessary repairs of the chips, sawing of the wafers and packaging of the individual chips. The entire packaging process focuses on creating the optimal conditions for our sensitive products. Laser saws, innovative materials, complex gluing and contacting processes as well as lead-free soldering help us accomplish this.
The back-end segments of sensors, chip cards and chip embedding enable the development of comprehensive innovations across the complete supply chain: from chip production to wafer testing, preassembly, package development and the development of new materials.
In other words, innovation at Infineon does not stop with the invention. A consistently practiced culture of perfection – starting with the design and ranging all the way to the production in the clean room – results in high quality.
Important functions within our production
In Unit Process Development (UPD), you supervise individual processes in semiconductor production and are responsible for the development of stable, inexpensive and innovative processes. You take over new processes and products and define tests for quality assurance. Your goal is the continuous improvement of individual processes.
Individual processes are e.g.
- Ion implantation
- Chemical deposition
- Electrochemical deposition (plating)
- Bonding: Die bonding, wire bonding; especially for frontside / backside / through silicon metallization.
- Chip separation processes: e.g. mechanical sawing, laser sawing, thin grinding, laminating
With die bonding or wire bonding, for example, you focus on the metallization of semiconductor products and handle the frontside / backside / thru silicon metallization in particular. In your role you create an important interface between the frontend and backend in development activities.
Another main process in wafer production is etching. The target material is given structures with the aid of photo-resist masks. Subsequently the photo-resist mask is removed again through an ashing process.
In the preassembly area, we work with mechanical and laser-supported chip separation procedures, e.g. mechanical sawing, laser sawing, thin grinding, laminating. Due to the growing requirements in the field of separating the thinnest wafer chips, new challenges have to be mastered in terms of material and process. Here you will work on a worldwide level with technology and/or package development and the production sites. With the area of optical inspection, we strive for a continuous improvement of our preassembly production. In this process we safeguard our production and developments and optimize error recognition.
As an engineer for process integration, you assume responsibility for the entire process engineering for a technology and supervise it fully autonomously during the ramp-up phase. You have various interfaces with technology development, individual process development, quality management, production, logistics, finance and the business units in your own area along with upstream and downstream production areas in the frontend and backend.
As UPS process engineer, you supervise existing individual processes in semiconductor production and assist manufacturing and maintenance with problem-solving in the scope of your activities. In addition, the processes undergo focused improvements in regards to yield, quality, performance and cost.
Automated production facilities, modern transport systems, freely navigable robots – as a maintenance specialist in automation, you enter the networked world of Industry 4.0. Your role includes the servicing of transport systems and taking care of their maintenance. We offer you an intensive initial training period during which you can get to know our systems. The work is performed on a shift basis and partially in a clean room.
Are you comfortable around large machines and clean rooms? And, like a detective, have a sixth sense for systematically uncovering the causes of system failures and remedying them? Then we would like to meet you. As a maintenance specialist in frontend production, you make sure that our production systems run seamlessly. We offer you an intensive initial training period under the guidance of an expert. The work is performed on a shift basis. Find out more here.
Our products run through various frontend and backend stations during the production. The sequence of these stations is the internal supply chain that connects customers and suppliers in respect to product, information and services in the production.
The Factory Integration unit within our corporate supply chain supports our frontend and backend wafer productions with software systems worldwide. The transport, identification and loading of the processed materials are controlled and monitored in the fully automated production process. We are internal service providers for software systems in wafer production. Our software is created in our international software teams and rolled out at the respective company locations.
As a software engineer, you receive new functional requirements from automation at the frontend sites Regensburg, Villach and Kulim, perform complex requirement analyses from internal customers and support software systems during company operations. In this process you interface with production, other company locations, their factory integration departments and external contractual partners.