Infineon Introduces Low-Power CODEC/SLIC Single-Chip for Voice Terminal Applications and VoIP-Enabled PCs
Munich, Germany – June 13, 2007 – Infineon Technologies AG (FSE/NYSE: IFX), a leading provider of communication ICs, today introduced the newest member of its DuSLIC® (Dual-channel Subscriber Line Interface Circuit) family of products for voice and VoIP-enabled devices. DuSLIC-xT is an energy-efficient CODEC/SLIC that offers best in class cost position for a complete voice enabled system. It reduces the overall bill-of-material for voice and VoIP systems including cable modems, analog terminal adaptors (ATA) and VoIP terminal applications by up to 50% depending on system specifications and requirements. DuSLIC-xT also helps to shrink the line interface unit footprint by up to 40% compared to current solutions.
The DuSLIC-xT includes an integrated high definition (HD) audio interface which allows the device to provide an interface between a PC or laptop and an analog phone. Such voice-integrated PC applications enable users to make low-cost, high-quality VoIP telephone calls by connecting an analog phone directly to a PC or laptop.
DuSLIC-xT provides the following extended features:
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Integrated test and diagnostic functions (ITDF) for loop monitoring supporting the GR-909 standard as well as additional sophisticated test measures, to ensure real-time monitoring of voice quality and network stability.
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Integrated wideband support to offer unmatched audio quality in future voice communications.
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Optimized DC/DC-based supply voltage generation and patented “balanced” internal ringing to minimize power dissipation. The device sets new industry benchmarks, drawing up to 20% less power than today’s best-in-class solution.
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A fully flexible power supply concept allows DuSLIC-xT to utilize one integrated DC/DC converter to feed all voice channels, while a second integrated converter can be used for other system tasks.
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All relevant parameters are programmable via software so different markets can be served with a single hardware design that meets all worldwide voice standards.
With more than 500 million lines currently in operation that use Infineon’s CODEC/SLIC chip solutions, there is no doubt that Infineon is the market leader for voice applications, providing mature and field proven technology.
“As VoIP gains mass market acceptance, our customers are looking to gain additional business in voice terminal applications, while extending to new untapped markets. DuSLIC-xT simplifies system design by minimizing the development time and the bill-of-material (BOM) and paves the way for PC-based VoIP applications that will further fuel customer adoption,” said Christian Wolff, Senior Vice President of the Communication Solutions business group and General Manager of the Wireline Access business unit at Infineon.
Availability
DuSLIC-xT (PEF 3201, PEF 3101) can be offered as either a dual channel or single channel solution. The product combines one dual-channel CODEC and two single channel high-voltage SLICs in a PG-TQFP-100 package. Engineering samples including system design package will be available in July 2007.
More information is available on the Infineon web site: www.infineon.com/duslic-xT
About Infineon
Infineon Technologies AG, Munich, Germany, offers semiconductor and system solutions addressing three central challenges to modern society including energy efficiency, connectivity and security. In fiscal year 2006 (ending September), the company achieved sales of Euro 7.9 billion (including Qimonda sales of Euro 3.8 billion) with approximately 42,000 employees worldwide (including approximately 12,000 Qimonda employees). With a global presence, Infineon operates through its subsidiaries in the US from Milpitas, CA, in the Asia-Pacific region from Singapore, and in Japan from Tokyo. Infineon is listed on the Frankfurt Stock Exchange and on the New York Stock Exchange (ticker symbol: IFX).
Information Number
COM200706.066
Press Photos
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The DuSlic-xT features Voice functionality offering lowest bill of material, lowest energy demand and smallest footprint in the industry.DuSLIC-xT2
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