Infineon adds the AIROC™ CYW20820 Bluetooth® & Bluetooth® LE system on chip for flexibility, low power, and high-performance connectivity

Munich, Germany – 14 June, 2022 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is adding the AIROC™ CYW20820 Bluetooth® & Bluetooth® LE (low energy) system on chip (SoC) to its AIROC Bluetooth Portfolio. The AIROC CYW20820 Bluetooth & Bluetooth LE SoC is a Bluetooth 5.2 core spec compliant device tailor made for IoT applications. It is designed to support a wide spectrum of use cases for home automation and sensors including medical, home, security, and industrial, as well as lighting, Bluetooth Mesh, or any IoT application that needs Bluetooth LE or dual mode Bluetooth connectivity.

The AIROC CYW20820 Bluetooth & Bluetooth LE SoC provides reliable connectivity and low power with high performance compute capability integrating an ARM® Cortex®-M4 microcontroller unit with floating point unit. It is a highly integrated device with multiple digital interfaces, optimized memory subsystem, and power amplifier delivering up to 11.5 dBm transmit output power in LE and BR (basic rate) modes, reducing the device footprint and the costs associated with implementing Bluetooth solutions.

Infineon is also adding to its extensive AIROC Bluetooth module portfolio with three modules that include onboard crystal oscillator, passive components, and the AIROC CYW20820 system on chip. These highly integrated modules are globally certified to support fast time-to-market of IoT devices. The AIROC CYBT-243053-02, CYBT-253059-02, and CYBT-243068-02 modules are supported by ModusToolbox™ software and tools with code examples to support rapid development of Bluetooth applications.

“The AIROC CYW20820 Bluetooth, Bluetooth LE SoC and modules are key additions to our portfolio and provide a solution that is low-power, cost-efficient and with scalable performance. With certified AIROC modules, Infineon is taking care of key steps in Bluetooth design to enable customers to have the quickest path to market.” said Sonal Chandrasekharan, Vice President of the Bluetooth product line at Infineon.

Availability

The AIROC CYW20820 Bluetooth & Bluetooth LE SoC can be ordered now. More information is available at www.infineon.com/wireless.

About AIROC Wireless Connectivity Products

Infineon’s AIROC wireless products, including Wi-Fi, Bluetooth, Bluetooth Low Energy and Wi-Fi and Bluetooth combos, have shipped more than a billion devices and are the go-to choice for IoT solutions. The broad portfolio includes high-performing, reliable, ultra-low-power products that deliver robust industry-leading performance.

AIROC Bluetooth products leverage a common software framework and are pre-integrated with Infineon’s ModusToolbox software and tools, allowing developers to deliver high-quality, differentiated products to market on time and on budget.

Infineon makes the IoT work

Microelectronics make up the core of every IoT solution. Infineon’s sensors, actuators, microcontrollers, communication modules, and security components underpin every device. The company is a one-stop technology partner for realizing smart, energy-efficient, and secured IoT applications with development boards, evaluation kits, and design tools additionally supporting manufacturers. More information about Infineon’s contribution to IoT: www.infineon.io.

Infineon at Embedded World

Embedded World will be held 21 to 23 June, 2022 in Nuremberg, Germany. Infineon will show its products and solutions in hall 4a, booth #138 and virtually. Company representatives are also holding several presentations at the accompanying Embedded World Conference, followed by discussions with the speakers. If you are interested in talking to an expert at the show, email media.relations@infineon.com, industry analyst, email: MarketResearch.Relations@infineon.com. Information about the Embedded World show highlights is available at www.infineon.com/embeddedworld.