CIPOS™ Tiny complements Infineon’s families of IPMs
Munich, Germany – 30 April 2019 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) adds a new member to its growing family of intelligent power modules (IPMs): CIPOS™ Tiny. The 3-phase inverter module is the newest generation of IPM to offer the highest power density for variable speed motor drives. By using the latest TRENCHSTOP™ IGBT6, it is possible to realize maximum efficiency with minimum footprint. Applications profiting from CIPOS Tiny include high efficiency washing machines, fans, compressors, and industrial drives. The IPM will allow customers to reduce system cost, improve reliability, and lower energy consumption. CIPOS Tiny will be showcased at PCIM 2019
The advanced CIPOS Tiny is molded in a compact and fully isolated thermally enhanced 34 x 15 mm² package. In addition, system mechanical design flexibility is also considered by offering both Tiny SIP and DIP form factors. It offers an integrated high precision temperature monitor, over-current protection, and under-voltage lockout function. With these features, the IPM delivers a high system level protection and enables fail-safe operation. Utilizing the newest single 3-phase level-shifting high voltage driver IC adds to highest efficiency and ruggedness. The gate driver is compatible down to 3.3 V controller outputs.
The CIPOS Tiny IM393 series features a blocking voltage of 600 V and four output current class: Tiny S (6 A) / Tiny M (10 A) / Tiny L (15 A) / Tiny X (20 A).
All eight devices can be ordered now. More information is available at www.infineon.com/cipos-tiny.
Infineon at the PCIM 2019
At the PCIM 2019 tradeshow, Infineon is presenting innovative product-to-system solutions for applications that are set to power the world and shape the future. Infineon’s demos are presented at booth #313 in hall 9 (Nuremberg, Germany, 7-9 May 2019). Information about the PCIM show highlights is available at www.infineon.com/pcim.
The advanced CIPOS Tiny is a 3-phase inverter molded in a compact and fully isolated thermally enhanced 34 x 15 mm² package. System mechanical design flexibility is considered by offering both Tiny SIP and DIP form factors.CIPOS_Tiny_DIP
JPG | 377 kb | 1500 x 683 px
The advanced CIPOS Tiny is a 3-phase inverter molded in a compact and fully isolated thermally enhanced 34 x 15 mm² package. System mechanical design flexibility is considered by offering both Tiny SIP and DIP form factors.CIPOS_Tiny_SIP
JPG | 380 kb | 1500 x 646 px