World’s Smallest Integrated Receive Front-End Modules BGM103xN7 Series from Infineon for GPS and GLONASS Applications Now Available

Aug 3, 2011 | Market News

Neubiberg, Germany – August 3, 2011 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today introduced a new series of Receive Front-End Modules for implementation of Global Navigation Satellite System (GNSS) functionality in Smart Phones and other handheld devices. The new BGM103xN7 Series devices are the first modules available that support separate or simultaneous reception of both Global Positioning System (GPS) and Globalnaya Navigatsionnaya Sputnikovaya Sistema (GLONASS) signals. Each of the three devices, optimized for different end platforms, offers low-power operation, exceptional protection against electrostatic discharge (ESD) and tiny package size (2.3 x 1.7 x 0.73 mm).

The BGM103xN7 modules combine the pre-filter and low noise amplifier (LNA) stages of the GNSS signal chain front-end to achieve a balance of performance improvements and space savings while reducing design time. The flexible solutions of Infineon meet key design goals, including high linearity to avoid interference of more powerful cellular signals, single-module coverage of the frequency range from 1575 to 1605 MHz, and optimized gain with very low noise for state-of-the-art sensitivity.

“Mobile device designers are challenged to deliver rock-solid sensitivity performance for location-based services, even as GNSS evolves to a series of systems operated by different entities and handheld devices incorporate more high-powered RF technologies such as Wi-Fi and LTE,” said Michael Mauer, Senior Marketing Director of RF and Protection Devices at Infineon Technologies.

Researchers at iSuppli estimate 2012 sales of 450 million smart phones, which nearly all support GNSS applications. With the new BGM series, Infineon helps designers meet requirements for personal navigation and location based applications not only for smart phones, but such portable devices as tablets, digital cameras and watches.

The three modules in the new BGM series, targeted for specific platform applications, are:


  • BGM1033N7: Standard solution meeting high-performance GPS/GLONASS specifications, with 14.8dB Gain and 1.65dB noise figure.
  • BGM1032N7: Matches BGM1033N7 features with optimization to suppress LTE Band13 signals. The upper frequency of the LTE 13 band is 787 MHz, and the second harmonic of this frequency (i.e. 1574 MHz) falls into the GPS band.
  • BGM1034N7: A high-gain (17.0 dB) version for systems with high losses in the receive chain, such as personal navigation devices and digital still cameras, where the potential for jamming due to high power cellular signals is less critical.


Common features of the series include low current consumption to meet mobile device requirements (4.0 mA / 3.1 mA), >43 dBc out-of-band rejection in cellular bands and 30 dBm input compression point in cellular bands. Each of the devices also offers an 8kV IEC ESD contact discharge specification at the RF input pin, which lets designers achieve ESD requirements with only one external component.

To meet diverse design requirements, the Infineon BGM103xN47 modules give engineers the flexibility to place any necessary post-filter (single-ended/balanced with suitable NF and attenuation) close to the GNSS receiver, while placing the pre-filter and LNA close to the antenna to achieve optimized sensitivity. Each of the modules feature a very low insertion loss / high out-of-band rejection pre-filter followed by a high performance GNSS LNA.

Availability, Pricing and Package
Modules are now available. Infineon also provides evaluation kits.
Typical pricing for BGM103xN7 modules is € 0.35/ $0.50 (10,000 piece volume). The devices are shipped in a TSNP-7-10 leadless package (2.3mm x 1.7mm x 0.73mm) which makes them the smallest available solutions in the market.

Further technical information on the all Infineon GNSS Receive Front-End Modules is available at

About Infineon

Infineon Technologies AG, Neubiberg, Germany, offers semiconductor and system solutions addressing three central challenges to modern society: energy efficiency, mobility, and security. In the 2010 fiscal year (ending September 30), the company reported sales of Euro 3.295 billion with approximately 26,650 1 employees worldwide. Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the over-the-counter market OTCQX International Premier (ticker symbol: IFNNY).

1Mentioned number of employees contains about 3,075 employees of the Wireless mobile phone business (Wireless Solutions), which was sold to Intel Corporation.

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