Infineon Presents new Compact IGBT Modules PrimePACK™ 3 and EconoDUAL™ 3 with Highest Power Density and Reliability
Neubiberg, Germany – May 5, 2010 – At the PCIM Europe 2010 in Nuremberg (May 4-6, 2010), Infineon Technologies presents new IGBT modules designed for highest power density and reliability: a PrimePACK™ module with 1400A in 1700V in a PrimePACK 3 packaging, and the new flagship of the EconoDUAL™ family, the EconoDUAL 3 with 600A in 1200V.
“Introducing the two new modules in the proven PrimePACK and EconoDual families, Infineon once again underlines its technological leadership in offering IGBT modules with highest power density for energy-efficient, compact designs,” says Martin Hierholzer, Vice President and General Manager Industrial Power at Infineon Technologies.
The new PrimePACK 3 module with the designation FF1400R17IP4 with 1400A in 1700V significantly widens the power range of the PrimePACK family. Target applications are, for instance, renewable energies, traction applications, CAV (Construction, Commercial and Agriculture Vehicles) and powerful industrial drives. The new IGBT module addresses the rapidly growing requirements in the market for higher power within the same compact dimensions, paired with highest reliability. The dimensions of the PrimePACK 3 are 89mm x 250mm. The new PrimePACK 3 module – like the entire family of products – has an intelligent, optimised chip layout and module design. This innovative packaging concept results in an improved distribution and dissipation of heat, reduced thermal transfer resistance between base plate and heatsink, and minimal internal leakage inductance.
The new EconoDUAL 3 module with the designation FF600R12ME4 is at present the most powerful product in the popular EconoDUAL family, offering 600A in 1200V. Typical applications are frequency converters in automation drive systems, central inverters in photovoltaic systems, and diesel generator drives in vehicles (CAV). The optimised module design with regard to interconnection technology and thermal resistance, results in high current utilisation and thus high efficiency. With the EconoDUAL 3 FF600R12ME4, the user can increase the power range by up to 30%, while the package dimensions remain the same. In addition to the familiar soldered version of the control contacts, the highly reliable PressFIT contact technology has been introduced in the EconoDUAL 3 family.
Samples of the IGBT module FF1400R17IP4 of the PrimePACK 3 family will be available as of the 3rd quarter of 2010, while start of volume production is planned for the 4th quarter of 2010.
Samples of the EconoDUAL 3 module FF600R12ME4 are also available, with series production planned for September 2010.
Further informations on the PrimePACK 3 module and the PrimePACK product family are available at www.infineon.com/primepack.
Further informations on the EconoDUAL3 module and the EconoDUAL product family are available at www.infineon.com/dual3.
Infineon Technologies AG, Neubiberg, Germany, offers semiconductor and system solutions addressing three central challenges to modern society: energy efficiency, mobility, and security. In the 2009 fiscal year (ending September), the company reported sales of Euro 3.03 billion with approximately 25,650 employees worldwide. With a global presence, Infineon operates through its subsidiaries in the U.S. from Milpitas, CA, in the Asia-Pacific region from Singapore, and in Japan from Tokyo. Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the over-the-counter market OTCQX International Premier (ticker symbol: IFNNY).
Infineon Presents new Compact IGBT Modules PrimePACK™ 3PrimePACK3
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