Infineon Introduces Power Modules PrimePACK Optimized for Industrial Applications and Windmills in Both 1200V and 1700V Voltage Classes

Munich and Nuremberg, Germany – May 22, 2007 – The new PrimePACK™ modules of Infineon Technologies AG (FSE/NYSE: IFX) in the 1200V and 1700V voltage classes are up to 45 percent lighter when compared to modules with the same power. Infineon is the sole semiconductor company that has achieved production status today for such compact and high-performing IGBT (Insulated Gate Bipolar Transistor) modules. The company introduced this family of compact IGBT modules that enable power converter system solutions optimized for various industrial drives, windmills, elevators, traction or auxiliary drives, power supplies and heating systems in trains and tractors at the PCIM 2007 Exhibition and Congress in Nuremberg.

The PrimePACK modules are based on an innovative packaging concept that also utilizes the advantages of the Infineon IGBT4 chips, which feature excellent electrical ruggedness. The unique module design offers many advantages, such as the special layout of the IGBT chips inside the module that significantly improves heat distribution. The IGBT chips are closer to the baseplate’s screw-fastening points, resulting in a low thermal resistance between the baseplate and heatsink. Internal stray inductance is reduced by approximately 60 percent from that of comparable modules.

The half-bridge configuration and modular design of the PrimePACK modules make it easy to scale the converter power by employing different module sizes or by connecting the modules of a given type in parallel. PrimePACK modules are available in both 1200V and 1700V voltage classes and in two module sizes - the 89mm x 172mm PrimePACK 2 and the 89mm x 250mm PrimePACK 3. These modules are up to 45 percent lighter than comparable modules with the same power. Lighter modules make it easier to construct and install power converters.

“The introduction of the PrimePACK modules illustrates that Infineon has carefully optimized these products to meet its customer needs,” said Martin Hierholzer, Senior Director and Head of Industrial Power at Infineon Technologies. “The innovative module design has been optimized for system integration, and to bring greater efficiency and ruggedness to industrial drive systems of all kinds.”

Availability

Volume production of the 1700V PrimePACK modules is available now. Volume production for the 1200V version is expected to begin in September 2007. The modules are produced in Warstein, Germany, and the IGBT diode and IGBT chips are manufactured in Villach, Austria. The modules are RoHS-compliant and meet fire protection requirements in accordance with NFF16-101 and 16-102.

Infineon is demonstrating the module family PrimePACK and other power innovations at the PCIM 2007 show (May 22-24, Nuremberg, Germany) at booth #404 in hall 12.

Further information on the new modules of Infineon is available at www.infineon.com/primepack

Infineon Technologies AG, Munich, Germany, offers semiconductor and system solutions addressing three central challenges to modern society including energy efficiency, connectivity and security. In fiscal year 2006 (ending September), the company achieved sales of Euro 7.9 billion (including Qimonda sales of Euro 3.8 billion) with approximately 42,000 employees worldwide (including approximately 12,000 Qimonda employees). With a global presence, Infineon operates through its subsidiaries in the US from Milpitas, CA, in the Asia-Pacific region from Singapore, and in Japan from Tokyo. Infineon is listed on the Frankfurt Stock Exchange and on the New York Stock Exchange (ticker symbol: IFX).