Infineon Leads Industry to Next Generation Server Memory Modules: Reports Standard Server Platforms Boot-Up Using New Fully-Buffered DIMMs
FB-DIMMs, which are expected to begin replacing Registered DIMMs in high-end sytems starting 2006, are JEDEC-standardized modules designed for high-density and high-speed operation. The FB-DIMM architecture is based on a new memory interconnect technology standard for high-end memory connections. An on-module Advanced Memory Buffer (AMB) chip speeds memory performance and allows higher memory capacity on each module, and so lays the groundwork for future generation high performance modules based on DDR2 and DDR3 DRAM.
Infineon is committed to meeting the requirements of customers developing the next generation of high-performance servers and workstations, said Michael Buckermann, Head of the Computing Unit of Infineons Memory Product group. With success in initial tests on platforms from several of our customers, we are now gathering key performance data and performing system level tests needed to pass the additional milestones leading to deployment of FB-DIMM on systems by the end of this year.
The combination of high memory density and the on-module AMB chip leads to significant heat generation in the FB-DIMM. To manage the thermal load, the JEDEC standards organization defined a heat sink as part of the module. Infineon has developed a single-piece heat sink with tighter mechanical dimensions than the JEDEC specification. Infineon will supply customer sample FB-DIMMs using its own heat sink design, which the companys tests indicate achieves superior thermal control.
The FB-DIMMs used in Infineons current demonstration systems are DDR2 based 512MB and 1GB modules with 533Mb/s or 667Mb/s speed grade. Infineon expects to release qualification samples of the modules to its customers by mid-2005, with initial customer shipments later this year.