Infineon Samples Industry`s Thinnest 4GB DDR2 Memory Modules for Servers; Dual-Die-Technology Doubles Memory Capacity
Munich, Germany February 25, 2005 Infineon Technologies AG (FSE/NYSE: IFX), demonstrating its leadership as memory supplier, today announced that it is sampling the industrys first dual-die based 4GB (Gigabyte) DDR2 registered DIMMs (Dual Inline Memory Modules) for server applications. The new module is based on eighteen 2Gbit (Gigabit) DDR2 components, realized by stacking two 1Gbit DDR2 SDRAMs. This approach called Dual Die technology allows to double memory density while increasing component height by only 0.1mm. Infineons 4GB DDR2 registered DIMMs with 4.1mm module thickness and standard-size 30mm height are by around 40 thinner than comparable solutions, hence outperforming JEDEC (Joint Electronic Device Engineering Council) requirements for stacked solutions. Thinner modules improve airflow and thermal conditions in current high-end DDR2 server systems, which can use up to four 4GB modules achieving a total memory capacity of 16GB per server system.
Dual Die technology is realized by stacking two identical dies in one BGA (Ball Grid Array) package. As an industry first, Infineon has mastered the challenges for volume manufacturing of high-speed DDR2 dual die chips. To meet production requirements, Infineon has developed additional process steps necessary to handle the complex interaction of several factors, from thermal and electrical factors to density, size and power consumption.
Opposed to conventional package stacking technologies, where two separate chip packages are stacked, Infineons Dual Die technology enables smaller package footprints with superior electrical and thermal characteristics.
Dual Die technology is realized by stacking two identical dies in one BGA (Ball Grid Array) package. As an industry first, Infineon has mastered the challenges for volume manufacturing of high-speed DDR2 dual die chips. To meet production requirements, Infineon has developed additional process steps necessary to handle the complex interaction of several factors, from thermal and electrical factors to density, size and power consumption.
Opposed to conventional package stacking technologies, where two separate chip packages are stacked, Infineons Dual Die technology enables smaller package footprints with superior electrical and thermal characteristics.
About Infineon
Infineon Technologies AG, Munich, Germany, offers semiconductor and system solutions for automotive, industrial and multimarket sectors, for applications in communication, as well as memory products. With a global presence, Infineon operates through its subsidiaries in the US from San Jose, CA, in the Asia-Pacific region from Singapore and in Japan from Tokyo. In fiscal year 2004 (ending September), the company achieved sales of Euro 7.19 billion with about 35,600 employees worldwide. Infineon is listed on the DAX index of the Frankfurt Stock Exchange and on the New York Stock Exchange (ticker symbol: IFX). Further information is available at www.infineon.com.
Information Number
INFMP200502.040
Press Photos
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Infineon`s 4GB DDR2 registered DIMMs with 4.1mm module thickness and standard-size 30mm height are by around 40 thinner than competing solutions, hence outperforming JEDEC (Joint Electronic Device Engineering Council) requirements for stacked solutions.Press PhotoJPG | 791 kb | 2126 x 1593 px
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The new module is based on eighteen 2Gbit (Gigabit) DDR2 components, realized by stacking two 1Gbit DDR2 SDRAMs. This approach called Dual Die technology allows to double memory density while increasing component height by only 0.1mm.Press PhotoJPG | 389 kb | 1535 x 1063 px
Press PhotoJPG | 10 kb | 160 x 111 px
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The new module is based on eighteen 2Gbit (Gigabit) DDR2 components, realized by stacking two 1Gbit DDR2 SDRAMs. This approach called Dual Die technology allows to double memory density while increasing component height by only 0.1mm.Press PhotoJPG | 391 kb | 1063 x 1535 px
Press PhotoJPG | 10 kb | 111 x 160 px
