Samsung Electronics Joins IBM, Chartered, Infineon in Next-Generation Semiconductor Logic Process Development
The technology alliance will reinforce its technology-based design point for next generation logic technologies, thus providing an industry-wide platform for CMOS logic processes.
Joint development takes place at IBMs 300 mm Advanced Semiconductor Technology Center in East Fishkill, N.Y., which began operation in July of 2003. Each company will have the ability to implement the jointly developed processes in its own manufacturing facilities.
Samsung is pleased to join this elite partnership, further enhancing technology and supporting services and accelerating market application of cutting edge technologies, said Dr. Chang Gyu Hwang, President and CEO of Samsung Electronics Semiconductor Business, This alliance is expected to create a technology platform for nano-scale CMOS logic processes, enabling customers to enjoy a broader source of the nextgeneration logic process technologies.
We welcome Samsung as an additional strong partner in our partnership and look forward in this now even more powerful alliance pushing the technology roadmap into the future, said Dr. Andreas von Zitzewitz, Chief Operating Officer Infineon Technologies AG.
A separate agreement will give Samsung license rights to IBM's 90 nm CMOS logic technology. Samsung plans to introduce IBM's proven logic technology to its highly integrated System-On-Chip (SOC) product line such as HD-TVs, DVDPs, and mobile applications. Based on Samsung's SOC business infrastructure, the advanced logic technology will be available to Samsung's internal and external customers, expanding IBM-based technology sourcing.
The participation of Samsung, a worldwide technology leader, along with our current prestigious partners, makes IBMs New York-based chip facility the worldwide center of expertise for silicon research and development, said Dr. John E. Kelly III, senior vice president and group executive, Technology, IBM Systems and Technology Group. Together we will create a global technology platform, providing clients with consistent chip making methods and multiple sources.
IBM Contact: Carrie Altieri (845) 892 5464