Infineon Samples Multimedia Baseband IC for GPRS Class 12 Phones
"Cellular phones are becoming increasingly complex, and integration of functions, such as GPRS, in a silicon baseband chip is key in meeting the design objectives of reducing component count, maintaining small handset formats and reducing power consumption, said Alan Brown, a principal analyst at Gartner Dataquest. Those vendors who are quick to market with a highly integrated baseband chip are going to be most successful in winning design-in slots and will stand a better chance of realizing volume production."
E-GOLD+ V3 is a highly integrated GSM/GPRS single chip mixed signal baseband IC containing all analog and digital functionality of a cellular radio. It is designed as a mixed signal single-chip solution, integrating the digital and mixed signal portions of the baseband together with 2Mbit on-chip SRAM in a leading edge 0.18 micron (0,13 micron effective) 1.8 V technology. E-GOLD+ V3 meets the changing demands of the GSM cellular subscriber market for low/mid-range devices with a low-cost, data-enabled mobile phone.
Infineon continues to be at the core of next generation wireless devices by providing advanced solutions to the wireless marketplace, said Ulrich Hamann, Senior Vice President and General Manager of the Wireless Group at Infineon Technologies. Our constant goal is to enable our customers with time-to-market advantages in this rapidly evolving and very competitive arena.
About Infineons GOLD Family
The GOLD family of ICs interface seamlessly with Infineons GSM/GPRS radio frequency (RF) solutions. A wide range of choices in communication interfaces allows designers to build complex data and multimedia systems. Due to a flexible interface design, members of the GOLD family can easily control a wide variety of RF architectures. For example, in combination with Infineons SMARTi RF solution, a complete two-chip system approach (offering all necessary baseband functionality) is achieved with an extremely compact implementation, low power consumption and cost effective system performance.
E-GOLD+ V3 is based on Infineons C166 controller and is manufactured with an advanced copper 0.18 micron (0,13 micron effective) CMOS process. The chip is available in a P-LFBGA 208 package with volume production scheduled for second quarter 2002.
Infineon Technologies AG, Munich, Germany, offers semiconductor and system solutions for applications in the wired and wireless communications markets, for security systems and smartcards, for the automotive and industrial sectors, as well as memory products. With a global presence, Infineon operates in the US from San Jose, CA, in the Asia-Pacific region from Singapore and in Japan from Tokyo. In the fiscal year 2000 (ending September), the company achieved sales of Euro 7.28 billion with about 29,000 employees worldwide. Infineon is listed on the DAX index of the Frankfurt Stock Exchange and on the New York Stock Exchange (ticker symbol: IFX). Further information is available at www.infineon.com
Infineon Samples Multimedia Baseband IC for GPRS Class 12 PhonesPress Picture
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