Infineon Technologies Announces Contract to Deliver Third Generation Cellular System Technology to Ericsson

Nov 13, 2000 | Market News

Munich – November 13, 2000 – Infineon Technologies AG (FSE/NYSE: IFX), one of the world's leading providers of communications integrated circuits today announced that they are collaborating with Ericsson to design a high-integration chip platform for third Generation (3G) broadband cellular systems. A device developed through this agreement will be the IWORX™ (InterWORking neXt generation) Asynchronous Transfer Mode (ATM) controller, a multi-service engine for wireless access networks and line card applications.

The agreement between the two companies will accelerate the mass deployment of 3G broadband multimedia services in wireless systems. 3G cellular technology is the successor to the different second generations of cellular networks (GSM, TDMA, cdmaOne, etc.) to support one worldwide mobile network technology. Designed to support E1/T1/J1 transmission rates and higher, the IWORX IC (Integrated Circuit) solution will enable equipment vendors to combine voice and data services for next generation wireless access systems.

The definition of the functional requirements for the IWORX solution is based on Ericsson’s network system expertise and Infineon’s ATM technology know-how. Infineon will design and manufacture the IWORX solution as a non-exclusive application specific standard product (ASSP), making it also available to other OEMs. The IWORX device will be implemented in Ericsson’s network platform for multi-service 3G cellular nodes.

"We are excited to be working with Ericsson on cutting edge solutions for this fast-moving market," said Christian Scherp, VP in Infineon's Communications business group and general manager of its Wide Area Network (WAN) Business Unit "The IWORX device will support high-speed wireless access to the Internet, delivering 3G multimedia services to the subscriber.”

First Product In 3G Wireless Platform

The IWORX device, a single-chip ATM controller that provides a gateway between ATM and time-slot based networks, supports AAL1 functionality for backward compatible operation with legacy 2G wireless networks as well as compressed voice over AAL2. Both functions are implemented in hardware to guarantee high performance in 3G networks. The device features IMA (Inverse Multiplexing over ATM) as well as all ATM Layer functions for stand alone capability. The IC will be using Infineon’s advanced embedded memory processes that enable system implementations with no additional external memory. First samples will be available in first quarter of calendar year 2001.

About Infineon

Infineon Technologies AG, Munich, Germany, offers semiconductor and system solutions for applications in the wired and wireless communications markets, for security systems and smartcards, for the automotive and industrial sectors, as well as memory products. With a global presence, Infineon operates in the US from San Jose, CA, in the Asia-Pacific region from Singapore and in Japan from Tokyo. In the fiscal year 2000 (ending September), the company achieved sales of Euro 7.28 billion with about 29,000 employees worldwide. Infineon is listed on the DAX index of the Frankfurt Stock Exchange and on the New York Stock Exchange (ticker symbol: IFX).

Further information is available at

Infineon, the stylized Infineon Technologies design are trademarks and servicemarks of Infineon Technologies AG. All other trademarks are the property of their respective owners.

Any statements in this document that are not historical facts are forward-looking statements that involve risks and uncertainties; actual results may differ from the forward-looking statements. Infineon Technologies undertakes no obligation to publicly release the results of any revisions to these forward-looking statements that may be made to reflect events or circumstances after the date hereof or to reflect the occurrence of unanticipated events.

Information Number