Infineon´s most advanced e-beam mask writer, a MEBES 5500 was delivered

Infineon´s most advanced e-beam mask writer, a MEBES 5500 was delivered. Final acceptance is scheduled for August 2000 and production will start in October 2000. The MEBES 5500 is designed to manufacture 4x-reticles for 0.15 µm chip generation. Its brand new writing modes MPGII and Fast PEC allow reasonable writing times even at small address grids with outstanding accuracy and a minimum feature size of 350 nm.

Infineon´s MEBES 5500 is the one and only installation in Europe.