Research, development and innovation projects

Infineon Dresden conducts research, development and innovation projects in future-oriented technology and product fields for topics such as future mobility, energy supply, data security and artificial intelligence. These projects are funded by the European Union, the Free State of Saxony and the BMBF.

The research and development projects are funded by the Eurpean Union, the Free State of Saxony and the Federal Ministry of Education and Research.

Thus, we collaborate with leading research institutions in national and international research co-operations. Infineon Dresden plays a leading role in EU pilot line projects like Power2Power.

Management of an EU joint project

Project start: 1 June 2019
Funding authority: ECSEL Joint Undertaking
Joint project with 43 partners from 8 European countries
Coordinator: Infineon Dresden

www.power2power.eu

Participation in EU joint projects with national funding by the BMBF and Saxony

Project start: 1 May 2020

Funding authority: ECSEL Joint Undertaking
Joint project with 79 partners from 14 European countries
Coordinator: Infineon Technologies AG

www.irel40.mind-net.org

 

Project start: 1 Mai 2019
Funding authority: ECSEL Joint Undertaking
Joint project with 80 partners from18 European countries 
Coordinator: Luleå university of Technology
 
Project start: 1 July 2018
Funding authority: PENTA
Joint project with 26 partners from 6 European countries  
Coordinator: Infineon Technologies AG
 
 
 

Participation in EU joint projects

Participation in BMBF joint projects

Closed R&D projects

Joint projects

  • NeePoS – New embedded power systems
  • intense2020 – Intelligent energy supply and sensor technology for the automotive electronics of the future
  • iDev40 – Integrated Development 4.0
  • TARANTO – TowARds Advanced bicmos NanoTechnology platforms for rf to thz applicatiOns
  • IPCEI – The BMWi supported the development and establishment of a production facility up to the first commercial use of innovative sensor technology for radar applications
  • Autodrive – Advancing fail-aware, fail-safe, and fail-operational electronic components, systems, and architectures for highly and fully automated driving to make future mobility safer, more efficient, affordable, and end-user acceptable
  • Productive40 – Electronics and ICT as enabler for digital industry and optimized supply chain management covering the entire product lifecycle
  • NEXGEN – Next Generation of Body Monitoring
  • SemI40 – Power Semiconductor and Electronics Manufacturing 4.0
  • IoSense – Flexible FE/BE Sensor Pilot Line for the Internet of Everything
  • POWERBASE – Enhanced substrates and GaN pilot lines enabling compact power applications
  • eRamp – Excellence in Speed and Reliability for More than Moore Technologies
  • EPPL – Enhanced Power Pilot Line
  • EPT300 – Enabling Power Technologies 300

 

Individual projects Infineon Dresden

  • PowerSystem – Higher power density through system solutions with efficient power MOSFETs
  • SERENUS – Systematic testing and research of novel substructure and sensor concepts
  • 5G-SWITCH – Novel solutions for RF-MOS devices
  • EFFIZIENT – Highly efficient power transistors for electric drives
  • EFFSIL300 – Efficient and safe power transistors based on 300mm wafers
  • IMAGINE – Novel 3D sensor technology for consumer goods based on the time-of-flight concept
  • VINEUS – Exploration of methods for the integration of new sensors and MEMS elements
  • FIFLA – FIN-FET Power semiconductors for automotive applications
  • HAP2014 – Autonomous factory automation, cluster research on mobile robot systems of a new generation
  • STOCKHOLM – Special wafer technology for power semiconductor systems
  • SMALL300 – Superjunction MOS-Transistors for Adapter, Lighting ans Low-Power switching power supply in 300mm
  • SMOLAN300 – Superjunction MOS-Transistors for easy applicability in 300mm
  • PRESTO – Principles of Processing for silicon-based terahertz technologies
  • Beehive – New Applications of energy storages