Research, development and innovation projects

Infineon Dresden conducts research, development and innovation projects in future-oriented technology and product fields for topics such as mobility of the future, energy supply, data security and artificial intelligence. These projects are funded by the European Union, the German Federal Ministry for Education and Research, the German Federal Ministry for Economic Affairs and Climate Action and the Free State of Saxony. 

The research and development projects are funded by the Eurpean Union, the Free State of Saxony and the Federal Ministry of Education and Research.

Thus, we collaborate with leading research institutions in national and international research co-operations.

Individual projects within the frame of the European integrated project "IPCEI on Microelectronics and Communication Technologies"

INNONEXT_IFD - Innovative semiconductor solutions for a green, digital and resilient Europe

Project start: 10. June 2022
Sponsors: European Union, Federal Ministry for Economic Affairs and Climate Action on the basis of a resolution of the German Bundestag and the Saxon State Ministry for Economic Affairs, Labour and Transport.

Project Coordination

Future Mobility – Green Mobility „made in Saxony” – Innovative Solutions for Future-oriented Automotive and Industrial Applications 

Project Start: 1 July 2023
Funding Authority: European Regional Development Fund (ERDF), Free State of Saxony
Joint Project with ten Partners from Saxony

Project Description: Population growth, urbanization and globalization as well as the associated environmental impact are leading to an increased need for decarbonization and digitalization solutions. This is particularly true in fields of application such as mobility. In the joint project "Green mobility 'made in Saxony' - Innovative solutions for future-oriented automotive and industrial applications (Future Mobility)", Infineon Dresden, as consortium leader, will work with ten partners along the entire value chain for microelectronics to develop innovative solutions for new types of power products and systems. Within this framework, development platforms as well as new methods and processes for more efficient product design and development will be addressed, which are suitable for various product and application families. This is accompanied by the corresponding technology development and process innovations. Concepts for transferring the developed products and technologies to high-volume production are also being researched.

Projektstart: 1 June 2023
Funding Authority: European Regional Development Fund (ERDF), Free State of Saxony
Joint Project with three Partners from Saxony

Project description: Advancing digitalization and the concept of Industry 4.0 increasingly require manually controllable systems to be replaced by automatically controlled or remote-controlled systems. A switch, realized by a power semiconductor and controlled by networked electronics, would be of great advantage here. Increased automation also requires suitable power transistors for drives such as robots or other production machines. The aim of LeistungsSchaltEr is to overcome the technological barriers to the future use of power transistors as relay or fuse replacements. Today's transistors are not suitable for this purpose. In the research project, a combination of new materials with breakthrough-resistant technologies should significantly improve the performance of systems. At the same time, a cost reduction can be achieved by using a new manufacturing process.

Project Start: 15 October 2023
Funding Authority: European Regional Development Fund (ERDF), Free State of Saxony
Joint Project with two Partners from Saxony

Project Description: In various fields of application, such as medical diagnostics, environmental analysis or energy technology, there is an increasing demand for new system solutions for sensor technology and data acquisition in order to combine different data sources against the background of digital transformation. As part of HELIOS, innovative, highly compact sensor solutions are therefore to be researched. The aim is to test both the possibility of integrating hardware and software sensor concepts on a single chip, as well as the use of artificial intelligence methods. The development of concepts for more powerful and more cost-effective sensors is intended to enable innovations in existing fields of application on the one hand and to open up new fields of application on the other.

Participation in EU-joint projects with national funding

PowerizeD - Digitalization of Power Electronic Applications within Key Technology Value Chains

Project Start: 1 January 2023
Funding authority: KDT Joint Undertaking
Joint project with  61 partners from 13 European countries
Coordinator: Infineon Technologies AG

www.powerized.eu

Project start: 1 February 2023
Funding authority: KDT Joint Undertaking
Joint project with  27 partners from  7 European countries
Coordinator: Infineon Technologies Austria AG

www.listen2future.eu

Project start: 1 May 2023
Funding Authority: KDT Joint Undertaking
Joint project with 52 partners from 12 European countries
Coordinator: Infineon Technologies AG

 

Participation in EU joint projects

QLSI – Quantum Large Scale Integration in Silicon

Project Start: 1 September 2020
Funding Authority: FET
Joint Project with 19 partners from 7 European countries  
Koordinator: CEA

www.qlsi.eu

Participation in national joint projects

Project start: 1 February 2021
Funding authority: BMBF
Joint project with 8 German partners
Coordinator: Forschungszentrum Jülich GmbH

QUASAR - Quantum Technologies (German language only)

Project start: 1 July 2022
Funding Authority: BMBF
Joint project with 4 German partners
Coordinator: Infineon Technologies AG

RadarSkin - Radar Sensor Technology (German language only)

Project start: 1 December 2023
Funding Authority: BMBF
Joint project with 27 German partners
Coordinator: Infineon Technologies AG

MANNHEIM-CeCaS - Supercomputing for Automotive (German language only)

Project start: 1 July 2023
Funding Authority: BMWK
Joint project with nine German partners
Coordinator: Infineon Technologies AG

Participation in joint projects in Saxony

HybridEcho – Micro-electronic hybrid systems in ultrasound

Project Start: 1 August 2023
Funding Authority: European Regional Development Fund (ERDF), Free State of Saxony
Joint Project with nine Partners from Saxony

Despite their many advantages, today's medical ultrasound technologies are severely limited, particularly in terms of image quality. The signal architecture of medical ultrasound is therefore currently far behind the current state of the art. For this reason, a new hybrid ultrasound method that fundamentally changes the state of the art is to be researched as part of HybridEcho. Overall, the targeted innovations offer the potential to drastically improve image quality, enabling novel medical applications such as transcranial ultrasound of cerebral hemorrhages or efficient tumor screening of the smallest lesions.

Project Start: 1 December 2023
Funding Authority: European Regional Development Fund (ERDF), Free State of Saxony
Joint Project with four Partners from Saxony

The ongoing interconnectivity of electronic components and systems in the Internet of Things and the increased requirements of modern mobile communication standards demand significant improvements in the functional parameters of the hardware used, with greater integration and miniaturisation. This is particularly relevant for applications in the areas of radio frequency, optics and radar. As part of the KoVoPack joint project, a technology platform for fully integrated, compact system-in-package solutions is to be researched. In order to achieve this goal, the joint project partners will investigate and develop innovative methods for integrating new types of materials and manufacturing concepts.

Closed R&D projects

Joint projects

  • KI-ASIC – AI processor architectures for radar modules in autonomous vehicles
  • iRel40 – Intelligent Reliability 4.0
  • Power2Power – The next-generation silicon-based power solutions in mobility, industry and grid for sustainable decarbonisation in the next decade
  • ArrowheadTools – Arrowhead Tools for Engineering of Digitalisation Solutions
  • ESAIRQ – Sensor technologies for measuring air quality
  • NeePoS – New embedded power systems
  • intense2020 – Intelligent energy supply and sensor technology for the automotive electronics of the future
  • iDev40 – Integrated Development 4.0
  • TARANTO – TowARds Advanced bicmos NanoTechnology platforms for rf to thz applicatiOns
  • IPCEI – The BMWi supported the development and establishment of a production facility up to the first commercial use of innovative sensor technology for radar applications
  • Autodrive – Advancing fail-aware, fail-safe, and fail-operational electronic components, systems, and architectures for highly and fully automated driving to make future mobility safer, more efficient, affordable, and end-user acceptable
  • Productive40 – Electronics and ICT as enabler for digital industry and optimized supply chain management covering the entire product lifecycle
  • NEXGEN – Next Generation of Body Monitoring
  • SemI40 – Power Semiconductor and Electronics Manufacturing 4.0
  • IoSense – Flexible FE/BE Sensor Pilot Line for the Internet of Everything
  • POWERBASE – Enhanced substrates and GaN pilot lines enabling compact power applications
  • eRamp – Excellence in Speed and Reliability for More than Moore Technologies
  • EPPL – Enhanced Power Pilot Line
  • EPT300 – Enabling Power Technologies 300

 

Individual projects Infineon Dresden

  • PowerSystem – Higher power density through system solutions with efficient power MOSFETs
  • SERENUS – Systematic testing and research of novel substructure and sensor concepts
  • 5G-SWITCH – Novel solutions for RF-MOS devices
  • EFFIZIENT – Highly efficient power transistors for electric drives
  • EFFSIL300 – Efficient and safe power transistors based on 300mm wafers
  • IMAGINE – Novel 3D sensor technology for consumer goods based on the time-of-flight concept
  • VINEUS – Exploration of methods for the integration of new sensors and MEMS elements
  • FIFLA – FIN-FET Power semiconductors for automotive applications
  • HAP2014 – Autonomous factory automation, cluster research on mobile robot systems of a new generation
  • STOCKHOLM – Special wafer technology for power semiconductor systems
  • SMALL300 – Superjunction MOS-Transistors for Adapter, Lighting ans Low-Power switching power supply in 300mm
  • SMOLAN300 – Superjunction MOS-Transistors for easy applicability in 300mm
  • PRESTO – Principles of Processing for silicon-based terahertz technologies
  • Beehive – New Applications of energy storages