FF6MR12W2M1_B70

Überblick

EasyDUAL™ 2B 1200 V, 6 mΩ half-bridge module with CoolSiC™ MOSFET, NTC temperature sensor, PressFIT contact technology and aluminium nitride ceramic. 

New generation M1H product FF4MR12W2M1H_B70 coming soon.

Zusammenfassung der Merkmale

  • High performance aluminum nitride ceramic
  • 1200 V CoolSiC™ trench MOSFET technology
  • Best-in-class Easy module package
  • Half-bridge configuration
  • PressFIT Technology

Vorteile

  • Better thermal conductivity of DCB material - RthJH improvement by 40% possible
  • Superior gate-oxide reliability of CoolSiC™ MOSFET
  • Power density and compact design
  • Minimization of cavity between module and heat sink
  • High degree of freedem for the inverter designer
  • Longer lifetime and less cooling effort
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