FF1MR12MM1HW_B11

Überblick

EconoDUAL™ 3 CoolSiC™ MOSFET half-bridge module 1200 V, 1.4 mΩ with enhanced generation 1, integrated NTC temperature sensor, PressFIT Contact Technology and wave structure on the back side of the base plate for direct liquid cooling.

Zusammenfassung der Merkmale

• Wave structure on the base plate
• Low switching losses
• Superior gate oxide reliability
• Higher gate threshold voltage 
• Higher Power output
• Robust integrated body diode
• High cosmic ray robustness
• High speed switching module
• T_{vj op} = 175°C overload
• PressFIT Pins 
• Screw power terminals
• Integrated NTC temperature sensor

Vorteile

• Optimized for direct liquid cooling
• High switching frequency
• Reduced volume and size
• Reduction of system costs
• High thermal efficiency

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