TOLG (TO-Leaded with Gullwing) package

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OptiMOS™ power MOSFETs in TOLG (TO-Leaded with Gullwing) package - for higher thermal cycling on board performance

This package offers the same high current and low profile features as the TO-Leadless (TOLL). The TOLG is compatible with the footprint to the TO-Leadless with the additional feature of gullwing leads for high thermal cycling.
The TOLG allows excellent electrical performance compared to D2PAK 7-pin with ~60 percent board space reduction. This package offers very low RDS(on) and is optimized to handle high currents >300A.
Thanks to the flexibility of gullwing leads, the OptiMOS™ family of MOSFETs in the TOLG package features excellent solder joint reliability on aluminum insulated metal substrate boards (Al-IMS). This results in 2x higher thermal cycling on board (TCoB) compared to the standard requirements (IPC-9701).
Key benefits of the TOLG include high efficiency, lower EMI as well as high power density enabling high performance and overall system efficiency.
 
The OptiMOS™ power MOSFET family in the TOLG package is available in a broad portfolio of voltages including 60V, 80V, 100V, 200V and 250V. Target applications include: e-scooter, (LEV) light electric vehicles, power tools and battery management system applications.
 

TOLG package (HSOG-8)
Infineon 3D interactive board model battery protection board

This interactive 3D model showcases Infineon's bidirectional switching board for battery protection featuring OptiMOS™ power MOSFET in TOLG package. 

Key features Key benefits Key applications
  • Best in class technology
  • High current rating >300 A
  • Low ringing and voltage overshoot
  • 60% space board reduction compared to D2PAK 7-pin
  • Gullwing leads
  • High performance capability
  • High system reliability
  • High efficiency and lower EMI
  • Optimized board utilization
  • High thermal cycling on board performance
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