IPL60R650P6S
Überblick
The new CoolMOS™ ThinPAK 5x6 is a leadless SMD package especially designed for high voltage MOSFETs. This new package has a very small footprint of 5x6mm 2 and a very low profile with only 1mm height.
This significantly smaller package size in combination with its benchmark low parasitics inductances can be used as a new and effective way to decrease system solution size in power- density driven designs. The ThinPAK 5x6 package is characterized by a very low source inductance 1.6nH, as well as a similar thermal performance as DPAK.
The package hence enables faster and thus more efficient switching of power MOSFETs and is easier to handle in terms of switching behavior and EMI.
Zusammenfassung der Merkmale
- Small footprint (5x6mm²)
- Low profile (1mm)
- Low parasitic inductance
- RoHS compliant
- Halogen free mold compound
Vorteile
- Reduced board space consumption
- Increased power density
- Short commutation loop
- Easy to use products
- Environmentally friendly
Potentielle Zielanwendungen
Videos
Qualität
Support
