IPDD60R050G7

Überblick

Double DPAK (DDPAK) Innovative top-side cooled SMD solution for high power applications

Infineon Technologies introduces Double DPAK (DDPAK), the first top-side cooled surface mount device (SMD) package addressing high power SMPS applications such as PC power, solar, server and telecom. The benefits of the already existing high voltage technology 600V CoolMOS™ G7 superjunction (SJ) MOSFET is combined with the innovative concept of top-side cooling, providing a system solution for high current hard switching topologies such as PFC and a high-end efficiency solution for LLC topologies.

Zusammenfassung der Merkmale

Gives best-in-class FOM R_DS(on) x E_oss and R_DS(on) x Q_g
Innovative top-side cooling concept
Inbuilt 4^th pin Kelvin source configuration and low parasitic source inductance
TCOB capability of >> 2.000 cycles, MSL1 compliant and total Pb-free

Vorteile

Enabling highest energy efficiency
Thermal decoupling of board and semiconductor allows to overcome thermal PCB limits
Reduced parasitic source inductance improves e iciency and ease-of-use
Enables higher power density solutions
Exceeding the highest quality standards

Potentielle Zielanwendungen

Telecom, Server, Solar, PC power and SMPS