950 V/1200 V TRENCHSTOP™ IGBT7 - Higher power density and optimized switching
The 950 V/1200 V TRENCHSTOP™ IGBT7 and EC7 diode technology is based on latest micro-pattern trenches technology which provide strongly reduced losses and offer a high level of controllability. This cell concept is characterized by implementing parallel trench cells separated by sub-micron mesas in contrast to the formerly used square trench cells. The chip is specially optimized for industrial drives applications and solar energy systems, which means much lower static losses, higher power density and softer switching. Additionally, by raising the allowed maximum operation temperature up to 175 °C at overload in the power module, a significant increase of power density can be obtained.
The developed chipset consisting of IGBT 7 and emitter-controlled 7-diode is optimized to meet all requirements of an inverterized general-purpose drive (GPD).
Good controllability, sufficient softness at all application-relevant current levels, a significant reduction in static losses, and a high short-circuit capability were achieved. In combination with the improvement of the EconoDUAL ™ 3 housing and the new temperature specifications to cover the overload requirements of the drives, the inverter designer has a high degree of freedom
The application tests show impressive improved performance compared to the previous generation, by achieving 38 K lower temperature with the same current. Alternatively, an output current that is up to 150 A higher can be realized. Taking into account the typical GPD criteria for normal and hard-wearing design, a frame size jump from 370 A to 477 A is possible with the EconoDUAL ™ 3 housing with IGBT 7 instead of IGBT 4 Inverterized
EconoDUAL™ 3 with TRENCHSTOP™ IGBT7
System simplification and reduced costs by highest power density and performance
The EconoDUAL™ 3 modules with the latest TRENCHSTOP™ IGBT7 chip generation extend the existing 1200 V IGBT4 portfolio with current ratings from 300 to 900 A . The FF750R12ME7_B11 and FF900R12ME7_B11 feature an improved housing for handling higher currents, and temperatures within the same footprint. FF300R12ME7_B11, FF450R12ME7_B11 and FF600R12ME7_B11 complete the portfolio towards lower current ratings.
In combination with the TRENCHSTOP™ IGBT7 technology, they show a significant reduction of losses, a high level of controllability and switching softness, as well as high short-circuit capability. Together with the maximum operation temperature of 175°C at overload, high efficiency and power density are achieved, enabling system simplification and cost reduction.
Easy Power Modules with TRENCHSTOP™ IGBT7
Our Easy 1B and Easy 2B family are fully equipped with the 1200 V TRENCHSTOP™ IGBT7 and Emitter Controlled Diode 7 technology. The portfolio offers current ratings from 10 A up to 100 A in PIM as well as sixpack configuration.
The chip is specially optimized for industrial drives applications, which means much lower static losses, higher power density and softer switching.
When exchanging the TRENCHSTOP™ IGBT4 with the IGBT7 solution, customers have three options to get the best out of their designs:
- Power class jump: 30% more current with IGBT7 in the same housing and with the same system cooling
- Frame size jump: 11% more output power plus system design reduction with IGBT7 and smaller housing
- Heat sink reduction: 40% reduction in heatsink performance with the same output power
The Easy 3B package with TRENCHSTOP™ IGBT7 technology extends the broad Easy portfolio in industrial drives applications to higher current ratings; 50 A, 75 A and 100 A in PIM configuration and 100 A, 150 A and 200 A in sixpack configuration.
Thanks to the same height of 12 mm for the whole Easy family, it is perfectly suited for platform designs in industrial applications, such as servo drives, robotics and air-conditioning.
In addition to industrial drives, the EasyPACK™ 3B with 950 V Active Neutral Point-Clamping (ANPC) is a total solution for 1500 V solar inverters. For MPPT (Maximum Power Point Tracker), Infineon offers a single module solution in dual-boost topology with 3 MPPTs in one module. Each of the MPPT can handle up to 26 A current. This makes this solution ready for bi-facial solar panels.
For the inverter stage, Infineon offers two solutions: one with Si diodes and one with CoolSiC™ Schottky diodes. The EasyPACK™ 3B with TRENCHSTOP™ IGBT7 and CoolSiC™ Schottky diode can achieve up to 10% higher power density.
In this training we will present TRENCHSTOP™ IGBT7 by focusing on its key features and technical benefits. We will also see the existing and planned portfolio of IGBT7 for industrial drives applications.
The EconoDUAL™ IGBT module is one of the most popular IGBT packages worldwide and is used in many different applications, such as General Purpose Drives; Commercial, Construction and Agricultural Vehicles as well as eBus; Solar; Wind; Traction; UPS and finally, Transmission and Distribution. In the latest module generation it is now feasible to increase the module current to 900 A. This is possible through the new IGBT7 technology enabling a higher power density and reduced BoM costs.