XHP™ Family - Boost your system!
Reach the next level of power density and system flexibility using XHP™
The demands on modern power electronics applications for industry, such as industrial drives, traction or renewables continue to rise. Harsh operating environments call for robust, low-maintenance designs. At the same time, cost pressures mandate standardized module designs capable of meeting application-specific requirements across a multitude of industries.
Traditionally, technological progress in power electronics has been driven and enabled by high-power semiconductors. The focus has typically been on optimizing chip technology rather than on package. However, as today’s modules and system requirements continue to evolve, current housing designs have reached their limits, highlighting the need for a new approach to packaging.
We have stepped up to this challenge and are proud to present the XHP™ family. This pioneering, high-power platform presents a modern solution for today’s cross-industry, cross-application demands for power density, efficiency, durability and robustness in two optimized housings. Designed for flexibility and reliability, these housings will support future chip generations, too. Both the XHP™ 2 and 3 will have the same dimensions, giving product designers the opportunity to build homogenous solutions across different current and voltage ratings.
The XHP™ family members will have the same housing dimensions of 140 mm in lengths and 100 mm in width. The height measures 40 mm. Both modules have been designed to cover the full voltage range from 1.7kV to 6.5kV. One key innovation is their scalability, which will greatly simplify system design and manufacturing. Additionally, due to its robust architecture, the new platform will provide long-term reliability.
A main focus in development is to achieve flexibility and reliability while assuring optimal integration into customer systems.
These module dimensions were chosen to offer a footprint similar to currently used IHV-A and IHV-B modules. Due to the unchanged length of 140 mm, identical extruded heat sink profiles can be used. Four modules with a footprint of 140x100 m will fit exactly into the space used today by two 140x190 mm IHV modules.
In comparison to existing products, Infineon`s new technology is characterized by its modular approach that leads to a considerable flexibility. Due to this concept, the new high power platform can be paralleled easily for various applications. Thus, the single module becomes a building block for units with higher current ratings. Paralleling of up to four devices will not require a derating from user side due to an excellent internal and external current
Paving the Way for a Homogenous High Power Platform
Infineon Technologies AG introduced the flexible high power platform XHP™. The first module available will be the high insulating package named XHP™ 3, designed for applications ranging from 3.3 kV to 6.5 kV like Medium Voltage Drives and Traction. The product ramp up of this 3.3 kV XHP™ 3 module will start this year.
Now, the development continues: the XHP™ 2 package for low voltage applications will increase the family’s field of applications. This module is being designed for applications of up to 3.3 kV like Drives, Renewables and Traction.
The XHP™ 2 and the high insulating package XHP™ 3 will have the same dimensions of 140 mm in lengths and 100 mm in width. The height measures 40 mm. Implementing the same dimensions will give product designers the opportunity to build homogenous solutions across different current and voltage ratings.
The upcoming XHP™ 2 package will feature three AC terminals and four DC terminals. This will ensure a balanced load on all terminals maximizing the current carrying capabilities of the overall package.
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