Thermal Interface Material (TIM)
TIM is the abbreviation for Thermal Interface Material
With the ongoing increase of power densities in power electronics the thermal interface between power module and heatsink becomes a larger challenge. A thermal interface material, especially developed for and pre-applied to our power modules outperforms the general purpose materials available. TIM not only provides the lowest thermal resistance, it also fulfills the highest quality standards given for power modules to achieve the longest lifetime and highest system reliability. TIM has been developed to fit to most of our existing power module packages as well as to upcoming future designs. Using modules with pre-applied TIM will achieve a reproducible thermal performance of power electronic applications.
Products with pre-applied Thermal Interface Material:
The Easy family with its EasyPIM™, EasyPACK™ and EasyDUAL™ configurations covers the full power range from IC 6 A up to 200 A at 600 V / 650 V / 1200 V. The modules are without a base plate and include the latest chip technologies like TRENCHSTOP™ IGBT7 and CoolSiC™ MOSFET. To simplify mounting, these modules are also offered with Thermal Interface Material pre-applied!
The EconoPACK™ 4 is our well known solution for applications where robustness and reliability matters. Now the best becomes even better: EconoPACK™ 4 is now available with Thermal Interface Material pre-applied!
The innovative EconoPACK™+ D-series takes care of reliable and solderless press-in contacts with PressFIT auxiliary terminals. The PressFIT contacts provide also the flexibility for a solder process, if required. The D-series is focused on a rugged and robust module design by injected molded control and power terminals and ultrasonic welded power terminals. Now available with Thermal Interface Material pre-applied!
With the EconoDUAL™3 family, we support the complete current ranges from 100 A up to 600A at 600 V / 650 V / 1200 V / 1700 V. Excellent mechanical robustness, power cycling capability, the option of PressFIT pins as well as the availability of TIM makes a reliable, cost effective solution for applications in drives, CAV, wind turbines, solar, and hybrid vehicles.
Flexibility, optimal electrical performance, highest reliability. These are the keywords for a successful inverter layout. 62 mm modules with pre-applied Thermal Interface Material are the right choice for your design.
Our PrimePACK™ IGBT Modules with TIM increase system reliability and optimize the thermal management. In addition handling in mounting and maintenance can be improved. This reduces process time in manufacturing.
Power Block modules in 50, 60 and 70 mm contains thyristors and diodes in voltage range of 1200 V to 4400 V and a current range of 240 A up to 1100 A. Now Infineon offers these modules with Thermal Interface Material pre-applied to simplify mounting (For details about modules with TIM please contact your local sales office).
With the release of the new 50 mm modules we extended our product portfolio of thyristor / diode modules in solder bond technology. Now Infineon Technologies Bipolar offers these modules with Thermal Interface Material pre-applied to simplify mounting.
||Predestined for demanding applications in respect to lifetime and durability|