High Power IGBT Modules available in different topologies with current ratings from 6 A to 600 A
Thermal Interface Material (TIM)
TIM is the abbreviation for Infineon`s new Thermal Interface Material. With the ongoing increase of power densities in power electronics the thermal interface between power module and heatsink becomes a larger challenge.
Power modules available with Silicon Carbide (SiC) diodes and transistors. These key components for modern and innovative power electronic solutions aim for the highest power density and efficiency. Those targets can be achieved by using the chips as stand-alone components or in combination with silicon power devices in power modules.
Modules for Photo-voltaic String and Multi-String Inverters
Tailor-made modules for photo-voltaic string and multi-string inverters. Optimised inverter efficiency and performance can be achieved. Fast and solder-less assembly is possible using the proven PressFIT technology.
The Econo family extends the power range from 15 A up to 300 A nominal current up to 1700 V. The Econo housing features a copper base plate for optimized heat spread and includes a thermistor (NTC). The Econo modules are available with solderable pins or with PressFIT pins and an increasing number of Econo modules is available with pre-applied TIM already.
The EconoPACK™ 4 package perfectly fits into the well-known Econo portfolio. EconoPACK™ 4 features screw power terminal, providing excellent electric connection. DC and AC link are separated and distinguishable at one glance for ease of use.
Infineon offers the well-established EconoDUAL™ 3 series. Our contribution to your success are new advanced assembly technologies, superb thermal performances to enable full power utilization, Plug and play upgrades of existing inverter designs and PressFIT and solder pin versions.
Flexibility, optimal electrical performance and highest reliability. These are the keywords for a successful inverter layout. The 34 mm and 62 mm product family of Half Bridges and Single Switches with the state-of-the-art IGBT4 Chip Technology perfectly fits into modern inverter concepts for all kinds of applications.
This module family provides all reliability characteristics known from the established PressFIT technology and comes up with advanced features. The complete housing family will follow the same mounting process and cover a possible current range up to 200 A distributed over the different housing sizes.
The innovative EconoPACK™+ D-series takes care of reliable and solderless press-in contacts with PressFIT auxiliary terminals. The PressFIT contacts provide also the flexibility for a solder process, if required. The D-series is focused on a rugged and robust module design by injected molded control and power terminals and ultrasonic welded power terminals.
A thermal interface material, especially developed for and pre-applied to Infineon`s power modules outperforms the general purpose materials available.
Customers of power electronics require ever more modern, easy connection technologies, which also provide a higher reliability to meet the trends to higher temperatures and new applications.
Accelerating the pace of innovation in industrial robotics
KEWAZO teamed up with Infineon to develop the world’s first on-site construction robot. The KEWAZO scaffolding robot eliminates personal safety risks, realizes significant savings on labor costs and accelerates assembly by 40% or more.
Storing solar energy at home - Long
New technology from Infineon promotes the adoption of renewables by enabling solar energy to be stored efficiently
Renewable energy from offshore wind farms
Energy means life: It heats houses, powers cars and lights megacities. The global appetite for energy is voracious, while resources are dwindling. One third of the energy consumed worldwide is electricity and the trend is rising.
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