F3L25R12W1T4_B27 1200 V, 25 A 3-level IGBT module

Überblick

EasyPACK™ 1B 1200 V, 25 A 3-level phase leg IGBT module with Trench/Fieldstop IGBT4, NTC and PressFIT Contact Technology.

Zusammenfassung der Merkmale

  • Fast trench IGBT4
  • Low inductive design
  • Low Switching Losses
  • Low V CEsat
  • Al 2O 3 Substrate with Low Thermal Restistance
  • Compact design
  • PressFIT Contact Technology
  • Rugged mounting due to integrated mounting clamps

Vorteile

  • Compact module concept
  • Optimized customer’s development cycle time and cost
  • Configuration flexibility
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