FF1000R17IE4 1700 V, 1000 A dual IGBT module

Überblick

PrimePACK™ 3 1700 V, 1000 A half bridge dual IGBT module with TRENCHSTOP™ IGBT4, NTC and fast switching chip. Also available with pre-applied Thermal Interface Material. 

Zusammenfassung der Merkmale

  • Extended operation temperature Tvj op
  • High DC stability
  • High current density
  • Low switching losses
  • Tvj op = 150°C
  • Low VCEsat
  • Package with CTI > 400
  • High creepage and clearance distances
  • High power and thermal cycling capability
  • Copper base plate
  • UL recognized

Vorteile

  • High power density
  • Standardized housing
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