F4-75R06W1E3

Überblick

EasyPACK™ 1B 600V fourpack IGBT module with TRENCHSTOP™ IGBT3, Emitter Controlled 3 diode and NTC.

Zusammenfassung der Merkmale

  • Low inductive design
  • Low Switching Losses
  • Trench IGBT 3
  • Low V(CEsat)
  • Al(2)O(3) Substrate with Low Thermal Restistance
  • Compact Design
  • Solder Contact Technology
  • Rugged mounting due to integrated mounting clamps

Vorteile

  • Compact module concept
  • Optimized customer’s development cycle time and cost
  • Configuration flexibility

Potentielle Zielanwendungen

Drives Solar Uninterruptible Power Supply (UPS) Home Appliances        

Simplify your design with one of our EiceDRIVER™ Compact HV Gate Driver ICs.

Diagramme
Simulation
Videos
9:21

EiceDRIVER™ 2EDL Driver IC Family

EiceDRIVER™ 2EDL is a 600V half bridge gate driver IC family basing on level-shifter SOI (Silicon on Insulator) technology, which integrates low-ohmic ultrafast bootstrap diode and supports higher efficiency and smaller form factors of applications. 

9:21

EiceDRIVER™ 2EDL Driver IC Family

EiceDRIVER™ 2EDL is a 600V half bridge gate driver IC family basing on level-shifter SOI (Silicon on Insulator) technology, which integrates low-ohmic ultrafast bootstrap diode and supports higher efficiency and smaller form factors of applications. 

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