Econo

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Econo Low and Medium Power product families

The low and medium power Econo products were developed in order to meet the demand for compact inverter designs, flexibility and optimized electrical performance at the highest levels of reliability.

The medium-power product families EconoDUAL™, EconoPACK™ 4 and EconoPACK™ + have a height of only 17mm, screw power terminals and are easy to assemble. Optimized gate driver connection is possible by placing the driver on top of the module. Low parasitic stray inductance and optimized thermal resistance to heat sink support to excellent inverter solutions.

The available configurations in the low-power arena are the well known EconoPIM™ and EconoPACK™ series. The Econo housing features a copper base plate for optimized heat spread and includes a thermistor (NTC). The modules provide a cost-effective compact design as well as simplified and reliable mounting. With these modules, we offer an optimized product generation for low- and medium-power industrial drives.

Produkte
Highlights

Highest power density with TRENCHSTOP™ IGBT7

The low and medium power Econo products are equipped with state of the art TRENCHSTOP™ IGBT7 and IGBT4 technologies for highest power density and leading-edge power cycling capability. All modules are available with our established PressFIT technology for reliable, solderless mounting, and pre-applied TIM. Selected Econo modules feature integrated shunts for accurate and cost efficient current sensing.

Key Features Main Applications
  • Compact module concept
  • Easy and ultra-reliable assembly: PressFIT control pins and screw power terminals for completely solderless connections
  • Easy separation of DC and AC links
  • No plugs or cables required
  • Optimized thermal resistance to heat sink
  • Ideal for low-inductive system designs
  • Highest power density for compact inverter designs
  • Pre-applied TIM (Thermal Interface Material) for lowest thermal resistance, increased system lifetime and simplified mounting
  • Optimizes customer development cycle time and cost
  • Configuration flexibility
  • High power density
  • Integrated temperature sensor available
  • Low stray inductance module design
  • RoHS-compliant modules

 

 

 

 

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