Econo

Überblick

Econo Medium-Power product family

EconoDUAL™, EconoPACK™ 4 and EconoPACK™ + meet the demand for compact inverter designs, flexibility and optimized electrical performance at the highest levels of reliability. These 17mm-high modules have screw power terminals and are easy to assemble. Optimized gate driver connection is possible by placing the driver on top of the module. Low parasitic stray inductance and optimized thermal resistance to heat sink support to excellent inverter solutions.

The EconoPIM™/EconoPACK™ families were developed in order to have a cost-effective compact design as well as simplified and reliable mounting. With these modules, we offer an optimized product generation for low- and medium-power industrial drives.

Produkte
Details
Key Features Main Applications
  • Compact module concept
  • Easy and ultra-reliable assembly: PressFIT control pins and screw power terminals for completely solderless connections
  • Easy separation of DC and AC links
  • No plugs or cables required
  • Optimized thermal resistance to heat sink
  • Ideal for low-inductive system designs
  • Highest power density for compact inverter designs
  • Pre-applied TIM (Thermal Interface Material) for lowest thermal resistance, increased system lifetime and simplified mounting
  • Optimizes customer development cycle time and cost
  • Configuration flexibility
  • High power density
  • Integrated temperature sensor available
  • Low stray inductance module design
  • RoHS-compliant modules

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PressFIT Technology

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Customers of power electronics require ever more modern, easy connection technologies, which also provide a higher reliability to meet the trends to higher temperatures and new applications.

PressFIT is a force fitting technology for power semiconductor modules, which offers these possibilities.

Thermal Interface Material

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A thermal interface material, especially developed for and pre-applied to Infineon`s power modules outperforms the general purpose materials available.

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