Automotive IGBT Modules
Automotive IGBT power modules based on leading IGBT technology designed for Hybrid electric and full Electric Vehicle (xEV) applications
Automotive power modules provide the ideal solution for converting the DC current from the electric battery into the AC current for the electric motor in hybrid and electric vehicles. Through our leading technologies with very low energy conversion losses, our automotive power modules contribute to increasing energy efficiency and battery range of electric vehicles.
Infineon automotive IGBT modules offer high voltage performance, fast switching, and extremely low switching losses, as well as flexible and compact designs. Designed with market leading technology, our IGBT power module automotive solutions are AQG 324 qualified and offer high mechanical robustness and ease-of-use in design and manufacturing. Additionally, our IGBT power modules can be used in other electric vehicle applications like on-board chargers, DC-DC converters, and auxiliary high voltage inverters for pumps and fans, providing high reliability, ease of use, and efficiency.
Infineon offers a wide range of automotive qualified IGBT Modules. Infineon´s HybridPACK™ family extends across the full power spectrum required by IGBT modules in hybrid and electric vehicles. Various product versions in six different packages enable maximum scalability across voltage and power classes, from 50 A to 900 A and 400 V to 1200 V (nominal chip values).
Thanks to leading IGBT and silicon carbide technologies our range of automotive qualified high-power modules all have one thing in common: They offer the highest power densities and efficiency. With several HybridPACK™ and EasyPACK™ product families to choose from, we can offer the best technical fit for a range of applications including main inverter, on-board charger, auxiliary inverter and DC-DC converter.
Automotive IGBT Modules Unterkategorien
- Our evaluation kits are designed to support customers in their first steps in designing applications with our power modules. All of our evaluation kits are open designs. Therefore, they can be taken as a design reference for applications utilizing HybridPACK™ or EasyPACK™ modules. In addition they can help to test the electrical and thermal performance of our power modules in an example application.
- Our main inverter evalution boards enable you to operate basic open loop inverters within a few minutes and without any software or communication to external control units.
- Passive three phase inductive loads and simple load tests (DEMO-MODE) can be driven up to the maximum performance of the power modules. The shipping content includes a data source with schematics, layout and bill of material, information on the gate driver board, logic board and interface PCB. For instance,the Evaluation Kit HybridPACK™ Drive is intended to demonstrate the outstanding performance of the latest Infineon IGBT generation EDT2 combined with our latest module package HybridPACK™ Drive. One of many approaches of designing inverters with our flexible molded modules can be found in the Evaluation Kit HybridPACK™ DSC. It implements our HybridPACK™ DSC S1 or S2 and demonstrates the modules double-sided cooling concept resulting in high power density and advanced sensing & diagnostic concepts.
- Another supported application which can be demonstrated with our Evaluation Kit for EasyPACK™ is the HV/LV DC/DC Converter. The evaluation board – and our highly efficient EasyPACK™ itself – help to achieve less charging losses, increased battery voltage and charging speed.
HybridPACKTM DSC is Infineon’s new innovative solution for the main inverter of hybrid and electric vehicles. It offers increased power density due to double-sided cooling of the molded module. The die temperature and current sensors can help to drive the IGBT closer to their limit to further improve the power density. HybridPACK DSC modules offer scalability via stacking to support customers’ platform approach.
HybridPACK™ Drive is a very compact power module optimized for hybrid and electric vehicle main inverter applications (xEV) for a power range up to 150 kW. The power module implements the new EDT2 IGBT chip generation, which is an automotive Micro-Pattern Trench-Field-Stop cell design. The chipset has benchmark current density combined with short circuit ruggedness and increased blocking voltage for reliable inverter operation under harsh environmental conditions.
Infineon’s HybridPACK™ family extends across the full power spectrum required by IGBT modules in hybrid and electric vehicles. The various product versions are achieved through package innovations and chip development within the product portfolio.