The EiceDRIVER™ 1EDI3030AS is an automotive qualified single channel high voltage gate driver optimized for SiC MOSFET.
The EiceDRIVER™ 1EDI3030AS uses robust Infineon Coreless Transformer Technology to provide bi-directional signal transfer across the galvanic isolation barrier.
Comprehensive safety features and ISO26262 compliance enable ASIL D classification on the system level. Accompanying safety documents ease and speed up FMEDA analysis in the application.
The compact package design and high level of feature integration save valuable PCB space and system cost, while pre-configured settings reduce design efforts.
Pin-compatible product variants make it easy to switch between variants and swiftly adjust ECUs to different application needs (i.e. SiC MOSFET vs IGBT).
Zusammenfassung der Merkmale
- Single-channel isolated SiC MOSFET driver
- For SiC MOSFET up to 1200 V
- High CMTI up to 150 V/ns
- 8 kV basic insulation according to DIN VDE V 0884-11:2017-01
- 6.8kV reinforced insulation according to DIN VDE V0884-11:2017-01
- Basic and reinforced insulation according to UL 1577
- Min. 12 A peak current rail-to-rail output
- Propagation delay 60 ns typical
- Typ. 10 A integrated Active Miller Clamp supports unipolar switching
- Integrated 12 Bit ADC for temperature measurements
- Integrated safety features to support ASIL B(D):
- DESAT and differential OCP protection
- Gate and output stage monitoring
- Shoot-through protection
- Primary/Secondary supply monitoring
- Internal supervision
- Advanced driver diagnosis with duty cycle coded DATA pin
- Green Product (RoHS compliant)
- AEC-Q100 qualified
- Compact DSO-20 fine pitch package
- Easy product use: pre-configured settings, no programming necessary
- Pin-compatibility makes it easy to switch between variants and swiftly adjust ECUs to different application needs (i.e. SiC MOSFET vs IGBT)
- Comprehensive safety features and ISO26262 compliance enable ASIL D classification on the system level. Accompanying safety documents ease and speed up FMEDA analysis in the application.
- Reduced BoM and PCB space due to feature integration and compact package design
|Product Variant||Driver Support||Additional Functionality|
|1EDI3020AS||IGBT||ADC for Temperature Diode|
|1EDI3021AS||IGBT||Active Short Circuit|
|1EDI3023AS||IGBT||ADC for NTC & DC-Link|
|1ED13030AS||SiC MOSFET||ADC for Temperature Diode|
|1EDI3031AS||SiC MOSFET||Active Short Circuit|
|1EDI3033AS||SiC MOSFET||ADC for NTC & DC-Link|