Innovative Smart Door Lock Solutions

The PSoC™ 4 portfolio consists of several families of Arm® Cortex®-M0 and Cortex-M0+ microcontrollers. Most devices in the portfolio include Infineon's CapSense technology for capacitive-sensing applications. Other key features in the PSoC™ 4 portfolio include a customizable analog front end through programmable analog blocks as well as wired and wireless connectivity options such as USB, CAN, and Bluetooth Low Energy. These unique features make PSoC™  a highly flexible and scalable low-power mixed-signal architecture.

The AIROC™ Wi-Fi & Combos portfolio includes a broad family of secure, robust solutions that enable you to bring great products to market faster. Infineon’s AIROC™ Wi-Fi & Combos portfolio integrates IEEE 802.11a/b/g/n/ac/ax Wi-Fi and Bluetooth 5.2 in a single-chip solution to enable small-form-factor IoT designs. For smart door lock, customers leverage Infineon’s AIROC™ CYW43012, an ultra-low power single-chip, combo device that features 1x1 dual-band 2.4 GHz and 5 GHz Wi-Fi 4 (802.11n) and Bluetooth® 5.0.

Infineon’s OPTIGA™ family of security solutions is designed for a variety of smart home use cases with easy integration into embedded systems to protect the confidentiality, integrity and authenticity of information and devices. These hardware-based security solutions scale from basic authentication chips to sophisticated implementations.

Near field communication (NFC) tags, also referred to as NFC sticker tags or NFC smart labels, are a short-range RF technology that use a base frequency of 13.56 MHz. It is a standards-based, secured contactless communication technology that enables devices that are close to each other to exchange data with just a tap. Infineon is a leader in the delivery of NFC-enabled secured, contactless solutions for smart home, delivering best-in-class security in a variety of packaging options suited to standalone tag applications and embedded NFC use cases.

The Infineon XENSIV^TM TLI493D family of extremely small low power 3D magnetic sensors is targeted at industrial and consumer applications. It uses our latest 3D Hall level package. Due to the small WLB-5 package (1.13 mm x 0.93 mm x 0.59 mm) and the low current consumption of 7 nA in power-down mode, the magnetic sensor is also suitable for use in applications that previously used resistor-based or optical solutions.

The REAL3™ image sensors are based on Infineon ToF (Time-of-Flight), which is the most advanced vision sensing technology in the world today and is already powering the smallest depth-sensing 3D camera modules on the market. From biometric identification, 3D scanning to hand gesture and body tracking, Infineon’s REAL3™ 3D image sensor delivers outstanding performance in 3D computational photography and augmented reality applications revolutionize the user experience.These single-chip imagers are sunlight-robust, highly scalable and ready for integration into a wide range of applications, including smart door lock, while meeting performance, power, size and cost targets.