MEMS 麦克风

综述

XENSIV™ - low self-noise (SNR), wide dynamic range, low distortions, high acoustic overload point

The popularity of voice user interfaces and the usage of audio recording to share information and experiences are increasing dramatically. However, the performance of microphones often limits the potential of today’s cutting-edge devices. Not anymore!

Infineon XENSIV™ MEMS microphones introduce a new performance class for digital MEMS microphones that overcomes existing audio chain limitations. IM69D130 is designed for applications where low self-noise (high SNR), wide dynamic range, low distortions and a high acoustic overload point are required.

Building upon the superior XENSIVTM MEMS microphone performance, Infineon’s extensive network of global partners offer customers a comprehensive portfolio of XENSIVTM MEMS microphone-based reference designs, as well as Infineon inside MEMS microphones that will propel audio performance to the next level even for the most demanding applications. Click on the buttons below to learn more and purchase our partner solutions.

产品
详情

Features & Benefits

Features Benefits
  • 69 dB(A) signal-to-noise ratio
  • Below 1 percent distortions at 128 dBSPL (AOP - 130 dBSPL)
  • Digital (PDM) interface with 6 μs group delay at 1 kHz
  • Tight sensitivity (-36 ±1 dB) and phase (± 2 deg) tolerances
  • 28 Hz low frequency roll-off
  • High fidelity and far field audio recording
  • Matched, noise and distortion free audio signals for advanced audio signal processing
  • Ultra-low group delay for latency-critical applications
  • No analog components required

Infineon´s Dual Backplate (DBP) MEMS technology

Infineon's dual backplate MEMS technology is based on a miniaturized symmetrical microphone design, similar as utilized in studio condenser microphones, and results in high linearity of the output signal within a dynamic range of 105 dB.

The microphone noise floor is at 25 dB[A] (69 dB[A] SNR) and distortion does not exceed 1 percent even at sound pressure levels of 128 dB SPL (AOP 130 dB SPL). The flat frequency response (28 Hz low-frequency roll-off) and tight manufacturing tolerance result in close phase matching of the microphones, which is important for multi-microphone (array) applications.

视频

Next generation of Voice-User-Interface applications with XENSIV™ MEMS microphones

1:30

Time to be heard. Infineon high performance XENSIV™ MEMS microphone offers premium speech recognition for VUI, even from across the room or when you whisper. Explore our complete system solution with RAW data, speech recognition algorithms and advanced audio processing under https://www.infineon.com/microphones

XENSIV™ IM69D130 microphone Shield2Go - Get studio recording quality within a few minutes.

1:57

How to get started with XENSIV™ MEMS IM69D130 microphone Shield2Go, e.g. required software, setup and Arduino libraries. https://www.infineon.com/makers

Creating powerful partnerships - Infineon partner ecosystem success stories

Elliptic Labs launches virtual security sensor demonstrator using XENSIV™ MEMS microphones

Elliptic Labs demonstrates with the MS Surface Pro X how our XENSIV™ MEMS microphones can be used to automatically lock the laptop screen when the user walks away from the laptop, simplifying laptop security features that make your data safe. Watch Laila Danielsen, the CEO of Elliptic Labs, explaining the joint solution and its benefits.

XENSIV™ MEMS microphones and Syntiant’s neural decision processor

2:21

Always on and ultra-low power voice pick-up on the edge. Cristal clear voice commands delivered to the edge of your application, picked up with ultra-low power consumption! Infineon´s best in class XENSIV™ MEMS microphones are redefining the standards for voice-user-interfaces in challenging situations. Exact voice-pick-up from long-distance, with a whispered voice or even in noisy environments is a challenge for smart assistants. When combined with Syntiant’s programmable Neural Decision Processors (NDPs) and their development platform NDP101B0, applications can be supported for audio and keyword classifications, on- and offline. This enables developers to create custom, always-on voice user interfaces, optimized for battery-powered devices.

ROBOY and Infineon bring the next generation of humanoid robotics to life

1:10

In this video, Rafael Hostettler, General Manager of Roboy, explains how Infineon and Roboy are creating the next generation of humanoid robots with equivalent sensory capabilities as humans. Roboy is a research organization in close collaboration with the Technical University of Munich, which tries to push the boundaries of innovation and to use technology in new, unexplored ways to develop the first humanoid robot. Infineon provides its latest state of the art products from the XENSIV™ product family. In the current version of ROBOY 2.0, three major products of Infineon are integrated: 60GHz radar MMIC (for material detection), MEMS microphone (for voice/speech detection) and 3D magnetic sensors (for natural movements of the body parts). The sensors give Roboy its humanity – he can see, hear, feel and understand what is happening around him.

CEVA and Infineon present a multi microphone smart speaker reference design for voice-controlled applications

2:10

Moshe Sheier, VP Marketing at CEVA, a leader in licensing signal processing platforms and AI processors, presents the CEVA ClearVox and WhisPro reference design for voice-user-interface (VUI) applications, enabled by Infineon digital MEMS technology. This reference platform is ideal for far-field speech recognition in devices, such as smart speakers, voice-enabled IoT, and home automation appliances. In addition, the 17 built in Infineon XENSIV™ MEMS microphones on CEVA’s ultra-low-power DSP-based platform allow engineers to select and define the position/location of the microphones in their final voice-user-interface application.

ZYLIA creates the world’s first portable recording studio with Infineon technology

3:31

Tomasz Zernicki, Co-Founder and CTO of Zylia, a leader in the field of 3D audio recording and production, speaks about the first-ever portable recording studio, the Zylia ZM-1. Equipped with 19 Infineon XENSIV™ MEMS microphones and a special software developed by Zylia, the solution can break down and isolate the different sound tracks in real-time, providing a truly unique music experience with high-quality sound.

XMOS and Infineon partner-up to create state of the art voice-controlled human machine interfaces

Our premium partner XMOS is a provider of voice and audio processing and control ICs. In this video, Gwen Edwards, Product Marketing Director at XMOS, talks about the company’s collaboration with Infineon to advance the future of human machine interfaces (HMI) and demonstrates the capabilities of the VocalFusion strereo development kit for Amazon AVS, powered by 4 configurable Infineon IM69D130 XENSIV™ MEMS microphones.

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Infineon inside MEMS microphone partners

Our Infineon inside MEMS microphone partners provide you with a full range of MEMS microphones suitable for a variety of applications.

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XENSIV™ MEMS microphone partner solutions

Premium MEMS microphones and cutting-edge audio processing are the key elements for making voice-controlled devices truly ready for everyday situations. Features like turning off a TV across different rooms as well as the ability to whisper to Alexa to dim down the light will be key differentiators of next-generation voice-user interfaces. That is why Infineon and its voice-user interface ecosystem partners are leveraging their technological expertise to provide innovative reference platforms and ready-to-use next-generation voice-user interface solutions. 

Customers looking for a reference design containing Infineon’s XENSIV™ MEMS microphones can contact one of our partners listed below. This section provides an overview and introduction to our partners and their offerings, as well as a relevant distributor or contact person for purchasing support. Kindly refer to the links used in the texts, company logo, and partner signet to navigate directly to the respective website for further information.

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