MEMS 麦克风 - Infineon Technologies

综述

XENSIV™ MEMS 麦克风

语音用户界面越来越普及，音频记录在共享信息和体验方面的使用正在急剧增加。然而，麦克风的性能往往限制了当今尖端设备的潜力。这种情况不会再继续下去了！

英飞凌 XENSIV™ MEMS 麦克风为数字 MEMS 麦克风引入了新的性能类别，克服了现有的音频链限制。IM69D130 专为需要低自噪声（高信噪比）、宽动态范围、低失真和高声过载点的应用而设计。

产品

详情

特性和优势

特性

优势

69dB(A) 信噪比
低于1%的失真，128分贝声压级（AOP——130分贝声压）
数字（PDM）接口，频率为1 kHz时有6微秒的群延迟
紧密的灵敏度（-36±1分贝）和相位差（±2度）容限
28 Hz低频率衰减

高保真度和远场录音

用于高级音频信号处理的匹配、噪声和无失真音频信号

用于延迟敏感型应用的超低群延迟

无需模拟组件

英飞凌的双背板（DBP）MEMS 技术

英飞凌的双背板 MEMS 技术基于微型对称麦克风设计，与录音室电容式麦克风类似，可以在105dB动态范围内实现输出信号的高线性度。

麦克风噪底为25dB[A]（69dB[A] SNR），即使声压级为128dB SPL（AOP 130dB SPL），失真度也不会超过1％。平坦频率响应 (28Hz低频滚降)和紧密制造公差导致麦克风的紧密相位匹配，这对于多麦克风 (阵列)应用非常重要。

文件

评估板

软件和工具

仿真工具

视频

Next generation of Voice-User-Interface applications with XENSIV™ MEMS microphones

1:30

Time to be heard. Infineon high performance XENSIV™ MEMS microphone offers premium speech recognition for VUI, even from across the room or when you whisper. Explore our complete system solution with RAW data, speech recognition algorithms and advanced audio processing under https://www.infineon.com/microphones

XENSIV™ IM69D130 microphone Shield2Go - Get studio recording quality within a few minutes.

1:57

How to get started with XENSIV™ MEMS IM69D130 microphone Shield2Go, e.g. required software, setup and Arduino libraries. https://www.infineon.com/makers

Creating powerful partnerships - Infineon partner ecosystem success stories

Elliptic Labs launches virtual security sensor demonstrator using XENSIV™ MEMS microphones

Elliptic Labs demonstrates with the MS Surface Pro X how our XENSIV™ MEMS microphones can be used to automatically lock the laptop screen when the user walks away from the laptop, simplifying laptop security features that make your data safe. Watch Laila Danielsen, the CEO of Elliptic Labs, explaining the joint solution and its benefits.

XENSIV™ MEMS microphones and Syntiant’s neural decision processor

2:21

Always on and ultra-low power voice pick-up on the edge. Cristal clear voice commands delivered to the edge of your application, picked up with ultra-low power consumption! Infineon´s best in class XENSIV™ MEMS microphones are redefining the standards for voice-user-interfaces in challenging situations. Exact voice-pick-up from long-distance, with a whispered voice or even in noisy environments is a challenge for smart assistants. When combined with Syntiant’s programmable Neural Decision Processors (NDPs) and their development platform NDP101B0, applications can be supported for audio and keyword classifications, on- and offline. This enables developers to create custom, always-on voice user interfaces, optimized for battery-powered devices.

ROBOY and Infineon bring the next generation of humanoid robotics to life

1:10

In this video, Rafael Hostettler, General Manager of Roboy, explains how Infineon and Roboy are creating the next generation of humanoid robots with equivalent sensory capabilities as humans. Roboy is a research organization in close collaboration with the Technical University of Munich, which tries to push the boundaries of innovation and to use technology in new, unexplored ways to develop the first humanoid robot. Infineon provides its latest state of the art products from the XENSIV™ product family. In the current version of ROBOY 2.0, three major products of Infineon are integrated: 60GHz radar MMIC (for material detection), MEMS microphone (for voice/speech detection) and 3D magnetic sensors (for natural movements of the body parts). The sensors give Roboy its humanity – he can see, hear, feel and understand what is happening around him.

CEVA and Infineon present a multi microphone smart speaker reference design for voice-controlled applications

2:10

Moshe Sheier, VP Marketing at CEVA, a leader in licensing signal processing platforms and AI processors, presents the CEVA ClearVox and WhisPro reference design for voice-user-interface (VUI) applications, enabled by Infineon digital MEMS technology. This reference platform is ideal for far-field speech recognition in devices, such as smart speakers, voice-enabled IoT, and home automation appliances. In addition, the 17 built in Infineon XENSIV™ MEMS microphones on CEVA’s ultra-low-power DSP-based platform allow engineers to select and define the position/location of the microphones in their final voice-user-interface application.

ZYLIA creates the world’s first portable recording studio with Infineon technology

3:31

Tomasz Zernicki, Co-Founder and CTO of Zylia, a leader in the field of 3D audio recording and production, speaks about the first-ever portable recording studio, the Zylia ZM-1. Equipped with 19 Infineon XENSIV™ MEMS microphones and a special software developed by Zylia, the solution can break down and isolate the different sound tracks in real-time, providing a truly unique music experience with high-quality sound.

XMOS and Infineon partner-up to create state of the art voice-controlled human machine interfaces

Our premium partner XMOS is a provider of voice and audio processing and control ICs. In this video, Gwen Edwards, Product Marketing Director at XMOS, talks about the company’s collaboration with Infineon to advance the future of human machine interfaces (HMI) and demonstrates the capabilities of the VocalFusion strereo development kit for Amazon AVS, powered by 4 configurable Infineon IM69D130 XENSIV™ MEMS microphones.

合作伙伴

XENSIV™ MEMS microphone partner solutions

Premium MEMS microphones and cutting-edge audio processing are the key elements for making voice-controlled devices truly ready for everyday situations. Features like turning off a TV across different rooms as well as the ability to whisper to Alexa to dim down the light will be key differentiators of next-generation voice-user interfaces. That is why Infineon and its voice-user interface ecosystem partners are leveraging their technological expertise to provide innovative reference platforms and ready-to-use next-generation voice-user interface solutions.

Customers looking for a reference design containing Infineon’s XENSIV™ MEMS microphones can contact one of our partners listed below. This section provides an overview and introduction to our partners and their offerings, as well as a relevant distributor or contact person for purchasing support. Kindly refer to the links used in the texts, company logo, and partner signet to navigate directly to the respective website for further information.

Company

Solution

Description

Details

Purchase

VocalFusion Dev Kit for Amazon AVS

xkvf3510

XK-VF3510-L71-AVS Development kit

The VocalFusion Dev Kit for Amazon AVS (XK-VF3510-L71-AVS) enables developers of smart home products to evaluate and prototype far-field voice interfaces using the XVF3510 voice processor with the Amazon Alexa Voice Service.

The VocalFusion XVF3510 enables far-field voice capture with close-range precision. It’s a turnkey solution for developers who want to embed far-field voice control into smart TVs and set-top boxes. XMOS algorithms are purpose-designed to deliver accurate voice capture from across the room, even in noisy environments, and when content is streaming through the device.

Sales region:
Global

Applications:
Smart TVs, Set-top boxes, TV accessories

Included IFX product:
IM69D130 MEMS mic

Watch video

Contact

VocalFusion stereo-AEC voice processor for Amazon Alexa Voice Service

XK-VF3500-L33-AVS Development Kit

This Amazon qualified development kit uses the XMOS stereo-AEC voice processor, which delivers up-close voice capture quality and processing accuracy at far-field range.

The rich optimization parameters of the XVF3500 voice processor enable you to adjust noise attenuation, gain control and residual echo to deliver the best voice capture performance for your product.

Sales region:
Global

Applications:
Audio-visual equipment like smart TVs, set-top boxes and media streamers

Included IFX product:
IM69D130 MEMS mic

Digi-Key

Future

VocalFusion mono-AEC voice processor for Amazon Alexa Voice Service

XK-VF3000-L33-AVS Development Kit

This Amazon qualified development kit uses the XMOS mono-AEC voice processor, which delivers up-close voice capture quality and processing accuracy at far-field range.

The rich optimization parameters of the XVF3000 voice processor enable you to adjust noise attenuation, gain control and residual echo to deliver the best voice capture performance for your product.

Sales region:
Global

Applications:
Audio-visual equipment like smart TVs, set-top boxes and media streamers

Included IFX product:
IM69D130 MEMS mic

Digi-Key

Future

AEV13MZ Development Platform

The Aaware Embedded Voice Platform™ using the signal from our high performance digital XENSIV™ MEMS microphones provides a complete development environment for VUI applications. It captures voice within loud interfering noise, and interfaces to popular wake-word and to automatic speech recognition (ASR) technologies on the edge from key partners such as Picovoice™ and Sensory®.

The combination of Aaware voice capture and these partner technologies enables voice controlled digital products with a single-chip solution that are private, secure, reliable and robust as it does not require a cloud infrastructure. The demo of the Aaware Embedded Voice Platform is powered by the Xilinx® Zynq® 7010 All Programmable SoC, enabling DSP and AI acceleration, all within the Avnet® MiniZed™ processing board.

Sales region:
Americas

Applications:
Robotics, kiosks, smart speakers, home hubs, automotive

Included IFX product:
IM69D130 MEMS mic

Watch video

Zedboard

CEVA Whispro & ClearVox Reference Design

This integrated audio processing and sound sensing reference platform enables application development and prototyping using real-time, full-speed CEVA DSP silicon combined with the Infineon MEMS microphone IM69D130.

The reference platform allows customers to barge into the market quickly with the highest-quality front-end sound processing, lowest power consumption and shortest time to market.

Sales region:
Global

Applications:
Smart speaker, voice-enabled IoT, smart TV, set-top box and OTT, headset

Included IFX product:
IM69D130 MEMS mic

Contact

Creoir Far Field Voice Solution

The Amazon qualified Far-Field Voice Solution enables fast path for prototyping and product development of Alexa-enabled devices.

Features include:

Solution scalable across i.MX Applications Processors series including i.MX 6, i.MX 7, and i.MX 8
Synaptics AudioSmart® Voice DSP enables superb far-field performance
Infineon XENSIV™ MEMS microphones, solution can be configured for 2mic or 4mic array
Yocto Linux SW with AVS client and Android companion app

Sales region:
Global

Applications:
Professional applications, such as industrial control, automotive infotainment, advanced HMI, building automation, high performance connected audio devices

Included IFX product:
IM69D130 MEMS mic

Contact

Smart Voice Interaction Module

This is a VUI turnkey solution (module/algorithm/software), including AI noise reduction, echo cancellation and voice activation algorithms.

Key features:

20x20mm form factor, can be easily integrated into systems
Whispering sound pressure level activation & works within 5m with only 1 mic
Cost effective: only one mic is needed
Tuning ready for multiple ASR platforms: Duros, Ali Genie, Xiaoai Tongxue
Supports 1 - 2 mics and 38 customized voice commands

Sales region:
Global

Applications:
Lighting, smart home appliances

Included Infineon products:
IM69D130 MEMS microphones

Contact

E NS -2 Mod ule

ENS-2 module is a noise reduction module specially developed for communication devices, which enables users to have a noise-free conversation. With the robust and powerful deep learning-based algorithms, ENS-2 can eﬀectively separate speech from background environmental noises and deliver unparalleled speech quality through an incredibly small form factor solution.

Small form factor, size of 12x15mm
Noise suppression: > 25dB
Cost effective: only one mic is needed and simple integration
Low power consumption
Broad range of applications: conference microphone, communications headset, in-car hands-free system, access control intercom, etc.

Sales region:
Global

Applications:
Conference system, headset, intercom, voice recorder

Included Infineon products:
IM69D130 MEMS microphones

Edge Voice Solution

The Edge Voice Solution is an off-line voice wake-up module, which uses Infineon’s IM69D130 MEMS mic. Aside from being highly flexible and low power (<1mA), this solution offers voice identification in multi-speaker scenario. Similarly, thanks to its sophisticated AI capabilities, customers can tailor the device to respond only to certain people.

Key features:
1. Keyword spotting (KWS) : Optimized KWS model for single microphone and low power chipset

2. Biometrics: enables IoT devices with voice print
Noise Reduction: ability to hear voices while enjoying music under noise isolation

Sales region:
Greater China

Applications: Hearable & wearable devices, such as TWS earphones & type-C&USB earphones

Included IFX products:
IM69D130

Contact

Sugr Sense VUI Downlight Solution

Sugr Sense VUI Downlight Solution is an Amazon Alexa Voice Service (AVS)-certified voice-user interface turnkey solution (module, algorithm, and software). It supports Alexa Call & Message (ACM), Multi-room Music (MRM), and can pick-up far field voice up to 10 meters in a quiet home environment.

Additional features include:

1. Supports multiple languages, such as Mandarin, English, etc.

2. Ready to integrate in multiple processing (e.g., ARM) & ASR platforms (e.g., Tencent)

3. Voice-user interface front-end hardware design (software/algorithm)

4. SoC control platform & system design

Sales region:
Greater China

Applications:
Smart home, smart speaker

Included IFX products:
IM69D130

Contact

NDP9101 Pi Neural Decision Processor Development Platform

The NDP9101 development platform contains the NDP101 along with components required to prototype applications such as keyword spotting, wake word processing and speaker identification consuming only 140µW. The Syntiant® NDP100™ ultra low-power Neural Decision Processor™ can support local voice commands, as shown in this video along with Infineon XENSIV™ MEMS microphones and also comes with the Amazon Alexa Voice Service keyword model which enables a close talk built-in Alexa experience. The NDP9101 consists of two boards connected together:

1. The NDP9101 board contains the NDP101 device along with power circuitry, audio microphones, clock generation, Flash Memory, & ARM Debug port.

2. The Raspberry Pi Model 3B+ is a single-board computer. The Raspberry Pi runs Raspian Linux and the Syntiant NDP10x device control SDK software and allows C and Python interaction with the NDP101 chips.

Sales region:
Americas

Applications:
Mobile phones, ear buds and hearing aids, Bluetooth headsets, smart watches, IoT endpoints, remote controls, smart speakers

Included IFX product:
IM69D120 MEMS mic

Contact

Swift Intelligent Voice Interaction Solution

Unisound’s solution is a standardized modular communication solution for smart home appliances. Additionally, it provides an all-in-one turnkey solution from voice-user interface (VUI) front-end signal processing to cloud service.

Its exclusive Swift AI chip and Infineon's IM69D130 MEMS microphone (linear + ring integrated) can be customized according to customer needs and serves online and offline applications. This solution has 5 major benefits:

1. No need for mobile phones as the user is the control center

2. Natural voice interaction

3. Far-field voice activation and recognition

4. Low power consumption
Standardized modules and interfaces, saving developers a lot of time and work.

Sales region:
Greater China

Applications:
Smart home appliances

Included IFX product:
IM69D130 MEMS mic

Contact

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