MEMS 麦克风-英飞凌(infineon)官网
XENSIV™ MEMS 麦克风
语音用户界面越来越普及，音频记录在共享信息和体验方面的使用正在急剧增加。然而，麦克风的性能往往限制了当今尖端设备的潜力。这种情况不会再继续下去了！
英飞凌 XENSIV™ MEMS 麦克风为数字 MEMS 麦克风引入了新的性能类别，克服了现有的音频链限制。IM69D130 专为需要低自噪声（高信噪比）、宽动态范围、低失真和高声过载点的应用而设计。
MEMS 麦克风-英飞凌(infineon)官网 子类别
特性和优势
| 特性 | 优势 |
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高保真度和远场录音 用于高级音频信号处理的匹配、噪声和无失真音频信号 用于延迟敏感型应用的超低群延迟 无需模拟组件 |
英飞凌的双背板（DBP）MEMS 技术
英飞凌的双背板 MEMS 技术基于微型对称麦克风设计，与录音室电容式麦克风类似，可以在105dB动态范围内实现输出信号的高线性度。
麦克风噪底为25dB[A]（69dB[A] SNR），即使声压级为128dB SPL（AOP 130dB SPL），失真度也不会超过1％。平坦频率响应 (28Hz低频滚降)和紧密制造公差导致麦克风的紧密相位匹配，这对于多麦克风 (阵列)应用非常重要。
Premium MEMS microphones and cutting-edge audio processing are the key elements for making voice-controlled devices truly ready for everyday situations. Features like turning off a TV across different rooms as well as the ability to whisper to Alexa to dim down the light will be key differentiators of next generation voice-user interfaces. That is why Infineon and its voice-user interface ecosystem partners are leveraging their technological expertise to provide innovative reference platforms and ready-to-use next generation voice-user interface solutions.
Customers looking for a reference design containing Infineon’s XENSIV™ MEMS microphones can contact one of our partners listed below. This section provides an overview and introduction to our partners and their offerings, as well as a relevant distributor or contact person for purchasing support. Kindly refer to the links used in the texts, company logo, and partner signet to navigate directly to the respective website for further information.
| Company | Solution | Description | Details | Purchase |
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VocalFusion stereo-AEC voice processor for Amazon Alexa Voice Service
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This Amazon qualified development kit uses the XMOS stereo-AEC voice processor, which delivers up-close voice capture quality and processing accuracy at far-field range. The rich optimisation parameters of the XVF3500 voice processor enable you to adjust noise attenuation, gain control and residual echo to deliver the best voice capture performance for your product. |
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VocalFusion mono-AEC voice processor for Amazon Alexa Voice Service
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This Amazon qualified development kit uses the XMOS mono-AEC voice processor, which delivers up-close voice capture quality and processing accuracy at far-field range. The rich optimisation parameters of the XVF3000 voice processor enable you to adjust noise attenuation, gain control and residual echo to deliver the best voice capture performance for your product. |
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This integrated audio processing and sound sensing reference platform enables application development and prototyping using real-time, full-speed CEVA-TeakLite-4 DSP silicon combined with the Infineon MEMS microphone IM69D130. The reference platform allows customers to barge into the market quickly with the highest-quality front-end sound processing, lowest power consumption and shortest time to market. |
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The Amazon qualified Far-Field Voice Solution enables fast path for prototyping and product development of Alexa-enabled devices.
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The microphone array solution is a software-integrated microphone array for products in the fields of consumer electronics, automotive electronics, and smart home. The array is flexible in configuration, adaptable to multiple scenarios, and support cost controllable. SoundAI’s far field intelligent interactive system SoundAI Azero, can achieve far-field acoustic processing, far-field voice wake-up, far-field voiceprint recognition, far-field speech recognition, far-field duplex call, among other functions. |
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The Aaware Embedded Voice Platform™ using the signal from our high performance digital XENSIV™ MEMS microphones provides a complete development environment for VUI applications. It captures voice within loud interfering noise, and interfaces to popular wake-word and to automatic speech recognition (ASR) technologies on the edge from key partners such as Picovoice™ and Sensory®. The combination of Aaware voice capture and these partner technologies enables voice controlled digital products with a single-chip solution that are private, secure, reliable and robust as it does not require a cloud infrastructure. The demo of the Aaware Embedded Voice Platform is powered by the Xilinx® Zynq® 7010 All Programmable SoC, enabling DSP and AI acceleration, all within the Avnet® MiniZed™ processing board. |
Applications: Robotics, kiosks, smart speakers, home hubs, automotive Included IFX product: |
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The NDP9101 Pi development platform provides a self-contained development platform for perceptual audio classification and feature extraction applications including keyword speech (KWS) recognition, wake word processing and speaker identification. The NDP9101 consists of two boards connected together: 2. The Raspberry Pi Model 3B+ is a single-board computer. The Raspberry Pi runs Raspian Linux and the Syntiant NDP10x device control SDK software and allows C and Python interaction with the NDP101 chips. |
Applications: Mobile phones, ear buds and hearing aids, Bluetooth headsets, smart watches, IoT endpoints, remote controls, smart speakers
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Unisound’s solution is a standardized modular communication solution for smart home appliances. Additionally, it provides an all-in-one turnkey solution from voice-user interface (VUI) front-end signal processing to cloud service. Its exclusive Swift AI chip and Infineon's IM69D130 MEMS microphone (linear + ring integrated) can be customized according to customer needs and serves online and offline applications. This solution has 5 major benefits: 1. No need for mobile phones as the user is the control center 2. Natural voice interaction 3. Far-field voice activation and recognition 4. Low power consumption |
Applications: Smart home appliances
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