INFINEON SECORA™ Pay 安全解决方案
SECORA™ Pay security solutions is a flexible, innovative one-stop solution for current and future payment needs.
SECORA™ Pay is a flexible, innovative one-stop solution for current and future payment needs. Infineon’s SECORA™ Pay solutions, with its excellent technology backed by extensive services and design-in support, enables contactless payment functionality to be integrated into virtually anything.
Infineon’s SECORA™ Pay is based on our unique SOLID FLASH™ microcontroller family, providing outstanding contactless transaction speeds and superior performance for today’s single- and multi-application projects. This family offers a complete portfolio supporting everything from contact cards to smart payment accessories.
Our innovative Coil on Module (CoM) chip package increases production efficiency and general robustness of dual-interface cards, increasing contactless credit card payment security while reducing costs. At the same time, the very small antenna design supports novel contactless payment factors such as smart watches with payment functionality.
- Increased contactless payment safety with fast, flexible payments
- Open standards including the interoperability standard EMVCo and the non-proprietary, open ticketing standard CIPURSE™ and Calypso.
- Dual-interface functionality, contact-based, and contactless transactions
- Supporting all common data authentication schemes
- Innovative contactless card security technologies like CoM and SOLID FLASH™
- Greater power efficiency
SECORA™ Pay Security Product Portfolio
The Infineon SECORA™ Pay portfolio delivers increased contactless payment safety through a range of solutions, including sophisticated Java Card™ technologies, pre-certified payment options, support for smart accessories and wearables, and Visa, Mastercard, Discover, and American Express payment support.
However, increased convenience and environmentally friendly solutions underpinned by the latest 40mn technology providing exceptionally thin modules for dual interface payment cards, easily personalized performance, and the use of recycled and ocean-bound plastics throughout our packaging options help push your contactless offerings to the next level.
The IINFINEON SECORA™ Pay portfolio comprises the Pay S, Pay X and Pay W variants.
INFINEON SECORA™ Pay S is a ready-to-use, optimized solution for standard Visa (VSDC) and MasterCard (M/Chip) payment cards.
| Operating System | Java Card 3.0.4, GlobalPlatform 2.2.1 |
| Interfaces and protocols | ISO 7816, ISO 14443 Type A, T=0 |
| Memory for user applets and user data | 16 KB |
| Cryptography | SDA/DDA/CDA (RSA, 3DES, SHA1, AES) |
| Contact and dual-interface package options* | Coil on Module packaging (based on inductive coupling) for easy and efficient dual-interface card production and easy, paperwork- based scheme approval
Flip chip packages for robust contact card production
*Pure contactless and other packaging options on request |
| Complementary 2/3rd wire antenna design optimized for 4th line embossing |
|
| Available and certified Infineon reference EMV applets |
|
INFINEON SECORA™ Pay X is a flexible enablement platform, giving customers the flexibility they need to address EMV-based payment schemes and deliver local content (to prepare for CPA, for instance). It comes with ready-to-use reference solutions for Visa, MasterCard and CIPURSE™ – the open standard for secured and cost-effective handling of payment, access and ticketing applications.
| Operating System | Java Card 3.0.4, GlobalPlatform 2.2.1 |
| Interfaces and protocols | ISO 7816, ISO 14443 Type A, T=0 |
| Memory for user applets and user data | Up to 190 KB SOLID FLASH™ NVM as platform-only configuration without any reference applets (Pay X) |
| Cryptography | SDA/DDA/CDA (RSA, 3DES, SHA1, AES) |
| Contact and dual-interface package options* | Coil on Module packaging (based on inductive coupling) for easy and efficient dual-interface card production and easy, paperwork- based scheme approval
Flip chip packages for robust contact card production
*Pure contactless and other packaging options on request |
| Complementary 2/3rd wire antenna design optimized for 4th line embossing |
|
| Available and certified Infineon reference EMV applets |
|
| Other optional applications |
|
INFINEON SECORA™ Pay W is a ready-to-use and optimized chip solution portfolio for smart accessories with standard Visa (VSDC) and MasterCard (M/Chip) functionality.
| Operating System | Java Card 3.0.4, GlobalPlatform 2.2.1 |
| Interfaces and protocols | ISO 7816, ISO 14443 Type A, T=0 |
| Memory for user applets and user data | 16 KB |
| Cryptography | SDA/DDA/CDA (RSA, 3DES, SHA1, AES) |
| Dual-interface package options |
|
| Wire antenna design | • SPA: antenna design included in delivery package • MCC8: antenna design will be tailored to customer needs |
| Available and certified Infineon reference EMV applets |
|
| Other optional applications |
|
