INFINEON SECORA™ Pay 安全解决方案

综述

INFINEON SECORA™ Pay –快速、高效的支付

INFINEON SECORA™ Pay 体现了英飞凌致力于为 EMV 标准提供安全、高效和简化的迁移路径。

INFINEON SECORA™ Pay is based on our unique SOLID FLASH™ microcontroller family providing outstanding contactless transaction speeds and superior performance for today’s single- and multi-application projects. This family offers a complete portfolio supporting everything from contact cards to smart payment accessories.

Furthermore, our innovative Coil on Module (CoM) chip package increases production efficiency and general robustness of dual-interface cards. At the same time, the very small antenna design supports novel contactless payment factors such as smart watches with payment functionality.

亮点

The IINFINEON SECORA™ Pay portfolio comprises the Pay S, Pay X and Pay W variants.

INFINEON SECORA™ Pay S is a ready-to-use, optimized solution for standard Visa (VSDC) and MasterCard (M/Chip) payment cards.

Operating System Java Card 3.0.4, GlobalPlatform 2.2.1
Interfaces and protocols

ISO 7816, ISO 14443

Type A, T=0
Memory for user applets and user data 16 KB
Cryptography SDA/DDA/CDA (RSA, 3DES, SHA1, AES)
Contact and dual-interface package options*

Coil on Module packaging (based on inductive coupling) for easy and efficient dual-interface card production and easy, paperwork- based scheme approval

  • S-COM8.6: 8-pin gold and palladium
  • S-COM8.4: 6-pin gold and palladium

Flip chip packages for robust contact card production

  • S-MFC6.6: 6-pin gold and palladium
  • S-MFC6.8: 8-pin gold and palladium

*Pure contactless and other packaging options on request
Complementary 2/3rd wire antenna design optimized for 4th line embossing
  • Standard CoM antenna sheets (white and transparent)
  • Holofoil and colored CoM antenna sheets (PVC from standard supplier matching customer color requirements)
Available and certified Infineon reference EMV applets
  • Visa
  • MasterCard
  • American Express and Discover.

INFINEON SECORA™ Pay X is a flexible enablement platform, giving customers the flexibility they need to address EMV-based payment schemes and deliver local content (to prepare for CPA, for instance). It comes with ready-to-use reference solutions for Visa, MasterCard and CIPURSE™ – the open standard for secured and cost-effective handling of payment, access and ticketing applications.

Operating System Java Card 3.0.4, GlobalPlatform 2.2.1
Interfaces and protocols

ISO 7816, ISO 14443

Type A, T=0
Memory for user applets and user data Up to 190 KB SOLID FLASH™ NVM as platform-only configuration without any reference applets (Pay X)
Cryptography SDA/DDA/CDA (RSA, 3DES, SHA1, AES)
Contact and dual-interface package options*

Coil on Module packaging (based on inductive coupling) for easy and efficient dual-interface card production and easy, paperwork- based scheme approval

  • S-COM8.6: 8-pin gold and palladium
  • S-COM8.4: 6-pin gold and palladium

Flip chip packages for robust contact card production

  • S-MFC6.6: 6-pin gold and palladium
  • S-MFC6.8: 8-pin gold and palladium

*Pure contactless and other packaging options on request
Complementary 2/3rd wire antenna design optimized for 4th line embossing
  • Standard CoM antenna sheets (white and transparent)
  • Holofoil and colored CoM antenna sheets (PVC from standard supplier matching customer color requirements)
Available and certified Infineon reference EMV applets
  • Visa
  • MasterCard
  •  American Express
  • Discover
Other optional applications
  • CIPURSE™ T applet

INFINEON SECORA™ Pay W is a ready-to-use and optimized chip solution portfolio for smart accessories with standard Visa (VSDC) and MasterCard (M/Chip) functionality.

Operating System Java Card 3.0.4, GlobalPlatform 2.2.1
Interfaces and protocols

ISO 7816, ISO 14443

Type A, T=0
Memory for user applets and user data 16 KB
Cryptography SDA/DDA/CDA (RSA, 3DES, SHA1, AES)
Dual-interface package options
  • MCC8
  • SPA
Wire antenna design • SPA: antenna design included in delivery package
• MCC8: antenna design will be tailored to customer needs
Available and certified Infineon reference EMV applets
  • Visa
  • MasterCard
Other optional applications
  • CIPURSE™ T applet
视频

Trusted Security. Trusted Transactions. Smart Card Solutions.

The world is changing rapidly. Connectivity and digitalization make our lives easier. But they also increase the need to secure our identities and personal information. Trust the right security solutions for smart cards and beyond to safeguard your sensitive data.

Coil on Module packaging innovation

Learn more about the innovative packaging technology from Infineon, which supports fast and easy transition from contact-based to dual-interface cards. Coil on Module was designed to increase the durability and robustness of smart cards. And at the same time, reducing costs for the manufacturer.

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