CoolMOS™ Latest Packages
CoolMOS™ Latest Packages 子类别
New 650V CoolMOS™ C7 Gold in TO-Leadless package (G7 series) features the perfect balance of high efficiency and ease-of-use, enabling for the first time the possibility of using an Surface Mount (or SMD) solution in mid to high power boost or power factor correction circuits (PFC).
ThinPAK 5x6 package, a new leadless SMD package for CoolMOS™, provides 80 percent volume reduction in comparison to traditional SMD packages such as DPAK. Infineon's CoolMOS™ CE in the new TO-220 FullPAK Wide Creepage package offers an extended creepage by increasing the distance between pins to 4.25mm versus the usual 2.54mm of the widely used TO-220 FullPAK package, reducing cost and additional process steps.
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