IM828-XCC

综述

CIPOS™ Maxi 1200 V, 20 A三相智能功率模块

基于1200 V， 55 mΩ CoolSiC™ MOSFET技术的CIPOS™ Maxi 三相智能功率模块封装在DIP 36x23D封装中，三相桥低端开路，提供了全功能紧凑型变频解决方案，具有优良的导热性能，适用于工业应用中的工业驱动器、暖通空调、有源滤波器和电机控制等。

特征描述

  • 采用1200 V CoolSiC™ MOSFET芯片
  • 在10 KHz时，可提供超过4.8 kW的电机功率输出
  • 高可靠的1200V 绝缘体上硅(SOI) 门极驱动IC
  • 过电流保护
  • 全通道欠压锁定保护
  • 触发保护时六个开关器件全部关闭
  • 内置死区时间，防止直通短路
  • 独立的热敏电阻用于过温保护
  • 故障清除时间可调
  • UL认证
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培训

How easy can it get - World's first 1200 V transfer molded Intelligent Power Module with SiC

Combining an optimized 6-channel 1200 V SOI gate driver and 6 CoolSiC™ MOSFETs in a DIP 36X23D package Infineon introduces the world's first 1200 V transfer molded Intelligent Power Module (IPM) with silicon carbide (SiC). The new CIPOS™ Maxi family member is aiming at variable speed drive applications such as industrial motors, pumps and HVAC - making it easy to integrate SiC in the power design of motors.
The presentation will give an overview of the CIPOS™ family of IPMs highlighting the specs of the new family member. Additionally, the advantages of CIPOS™ Maxi 1200 V for servo drives, fans and pumps as well as for heating, ventilation and air conditioning will be explained.

支持