PrimePACK™ IGBT 模块
出色的 PrimePACKTM IGBT 半桥模块和斩波器模块与内部 NTC 完美组合，为现代转换器集成带来独特的优化的概念。
该模块主要具备以下优势，高可靠性和终身使用要求、优化的热性能、低杂散电感、工作温度范围广、高隔离度集成式 NTC 以及英飞凌 TRENCHSTOPTM 技术。
PrimePACK™ with IGBT4
The standard PrimePACK™ modules with IGBT4 come in halfbridge or chopper configuration. The PrimePACK™ 2 and 3 packages offer high power density and thus enable compact inverter sizes.
This family of IGBT modules is available in 1200 and 1700 V TRENCHSTOP™ technology. It comes with an integrated NTC with high isolation.
PrimePACK™ with IGBT5 and .XT
Wind power applications require a high reliability and robustness, combined with system availability and long lifetime.
PrimePACK™ modules with IGBT5 and .XT meet those requirements: IGBT5 allows higher power density, whereas the .XT interconnection technology extends the lifetime by increased thermal and power cycling capabilities.
The IGBT5 chip generation allows for an increase in output current by around 30%, which made some changes to the PrimePACK™ housing necessary.
Download the whitepaper to read about the new housing investigation and an inverter under real application conditions
.XT interconnection technology addresses all reliability relevant levels within the power module package in order to realize long lifetimes under thermo-mechanical stress. In this whitepaper, the correlation of thermal cycling test data was correlated with the responsible failure mechanisms was explored.
PrimePACK™ with TIM as an option for both IGBT4 & IGBT5
Both IGBT4 as well IGBT5 PrimePACK™ modules are available with pre-applied thermal interface material (TIM).
PrimePACK™ IGBT modules with TIM increase system reliability and optimize the thermal management e.g. an 8 K reduction in Tj is observed when using Infineon’s TIM without the pump-out threat and degradation of thermal stability.
In addition handling in mounting and maintenance can be improved. This reduces process time in manufacturing.
Thermal interface material (TIM) is a key component in the majority of power electronic systems. Heat, generated by the semiconductors, has to be transferred to a heat sink and finally to ambient.
In this paper, you will read about the needs and the steps described in developing a thermal interface material, especially dedicated for the use in power electronics.
如今，电气化正在引起运输行业的变革。同时商用、建筑、农用车辆也向电力电子领域发起了挑战。从北极到沙漠，到处都可以发现机器工作的身影，它们运行时间长，停机时间短，并且长期面临冲击和震动。电气化为 CAV 打开了一个充满机会的全新世界，而英飞凌则可以提供专家解决方案，让您的设计如虎添翼。
- the history of wind energy and its future challenges
- a comparison between standard IGBTs and PrimePACK™ .XT IGBTs regarding their composition and production processes
- the solution for wind energy production in locations with low wind speeds
Get to know the broad classification of the Wind turbines. Do you want to comprehend the most widely used wind power converter topologies, the major advantage and disadvantages as well as the key requirements of a wind power converter?