F3L225R07W2H3P_B63 650 V 225 A 三电平 IGBT模块

综述

EasyPACK™2B 650 V三级相位支路 IGBT模块，具有高速IGBT H3 ，NTC温度检测，有源“第二类中点箝位”，PressFIT压接技术和预涂热界面材料 。

 

特征描述

  • 低电感设计
  • 低开关损耗
  • 低 VCE(sat)
  • Al2O3 基板热阻低
  • 紧凑型设计
  • PressFIT 压接技术
  • 集成的安装夹使安装更坚固

优势

  • 紧凑模块的概念
  • 优化客户的开发周期，降低成本
  • 灵活的配置

潜在应用

drives Uninterruptible Power Supply (UPS) Solar          

 

Please find further information about Boost and Inverter IGBT-modules especially designed for Solar String and Multi-String Inverters.

 

Please select a matching HV Gate Driver IC from our EiceDRIVER™ Portfolio.
With Infineon EiceDRIVER™ Enhanced and Compact Driver ICs as well as EiceDRIVER™ Safe Driver Boards we provide a broad spectrum of solutions for reliable and efficient controls of IGBT Modules.

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热界面材料（TIM）

一种专为英飞凌的电源模块开发的预应用热界面材料，其性能优于现有的通用材料。 TIM不仅具备最低热阻，而且还达到电源模块给定的最高质量标准，可以实现最长的使用寿命和最高的系统可靠性。 TIM的开发适用于我们现有的大多数功率模块封装以及未来即将出现的设计。使用预应用TIM的模块将能实现电力电子应用的可重现热性能。

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PressFIT Technology

Customers of power electronics require ever more modern, easy connection technologies, which also provide a higher reliability to meet the trends to higher temperatures and new applications.

PressFIT is a force fitting technology for power semiconductor modules, which offers these possibilities.

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