F3L225R07W2H3P_B63
综述
EasyPACK™2B 650 V三级相位支路 IGBT模块,具有高速IGBT H3 ,NTC温度检测,有源“第二类中点箝位”,PressFIT压接技术和预涂热界面材料 。
特征描述
- 低电感设计
- 低开关损耗
- 低 VCE(sat)
- Al2O3 基板热阻低
- 紧凑型设计
- PressFIT 压接技术
- 集成的安装夹使安装更坚固
优势
- 紧凑模块的概念
- 优化客户的开发周期,降低成本
- 灵活的配置
潜在应用
Please find further information about Boost and Inverter IGBT-modules especially designed for Solar String and Multi-String Inverters.
Please select a matching HV Gate Driver IC from our EiceDRIVER™ Portfolio.
With Infineon EiceDRIVER™ Enhanced and Compact Driver ICs as well as EiceDRIVER™ Safe Driver Boards we provide a broad spectrum of solutions for reliable and efficient controls of IGBT Modules.
仿真工具
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